Wearable PCB Damping Structure for Sensor Vibration Isolation

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Solution Overview

Problem

Wearable electronic devices experience vibrations due to the expansion and contraction of capacitors, which can lead to noise and interference with sound and biometric sensors, particularly in devices with limited space.

Innovation Solution

A damping structure is interposed between the printed circuit board and the biometric sensor structure, comprising first and second members with different repulsive forces to minimize vibrations and noise transmission.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If capacitors are mounted on the printed circuit board for operation, then the electronic device can perform its functions, but vibrations occur due to expansion and contraction of the capacitor

Engineering Contradiction:
Improvedevice functionalityVSAvoidvibrations
Core Design Contradiction:
Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

A damping structure is introduced as an intermediary element between the printed circuit board and the housing. This damping structure absorbs and dissipates the vibrations generated by capacitor expansion and contraction, preventing them from being transmitted to the housing and causing noise. The damping structure acts as a mediator that isolates the harmful vibrations while allowing the capacitors to continue their normal operation.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the damping structure is added to reduce vibrations, then noise and interference with sensors are minimized, but device complexity increases

Engineering Contradiction:
Improvenoise and sensor interferenceVSAvoidstructure complexity
Core Design Contradiction:
Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The damping structure is implemented as a thin, flexible damping film or sheet that is attached to the printed circuit board. This thin-film approach provides effective vibration damping without adding significant structural complexity or thickness to the device. The flexible nature of the damping film allows it to conform to the circuit board surface while maintaining its vibration-absorbing properties.

Inventive Principle:
Principle #30Flexible shells and thin films

3Volume of moving object

If device space is minimized for wearability, then the device is more suitable for wearable applications, but vibrations from capacitors more strongly affect sound and biometric sensors

Engineering Contradiction:
Improvedevice volumeVSAvoidsensor performance
Core Design Contradiction:
Volume of moving objectVSMeasurement precision

Solution Approach 1:

The damping structure serves as a vibration-isolating intermediary positioned between the capacitors on the circuit board and the sensitive sensors. Even in the limited space of a wearable device, this thin damping layer effectively blocks the transmission of capacitor vibrations to the sound and biometric sensors, preserving their measurement precision without requiring increased device volume.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The damping structure effectively reduces vibrations from capacitors, minimizing audible noise and maintaining the performance of both the sound and biometric sensors.

Implementation Method 1

a damping structure interposed between the biometric sensor structure and the printed circuit board and configured to elastically support the biometric sensor structure and the printed circuit board

Methodology Applied
Scientific EffectVibration damping: Damping

Implementation Method 2

configured to elastically support the biometric sensor structure and the printed circuit board

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS12572182B2Wearable electronic device comprising damping structure of circuit board
Publication Date: 2026.03.10 SAMSUNG ELECTRONICS CO LTD
  • US12572182B2 patent drawing
  • US12572182B2 patent drawing
  • US12572182B2 patent drawing

AI summary

A wearable electronic device is provided. The wearable device includes a bracket, a printed circuit board that at least partially faces a first surface of the bracket, a sound sensor structure disposed on a second surface of the bracket, a biometric sensor structure that overlaps the first surface of the bracket with respect to a direction that is perpendicular to the printed circuit board and a damping structure interposed between the biometric sensor structure and the printed circuit board. The damping structure may elastically support the biometric sensor structure and the printed circuit board.