Wearable Article Recess for Electronics Module Positioning
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Solution Overview
Problem
Existing wearable articles with sensing components face issues such as the electronics module sliding out of position due to wearer motion, leading to disrupted communication with sensing components, and lack of effective attachment mechanisms that do not require metal fasteners.
Innovation Solution
A wearable article design featuring a recess in the flexible material to securely seat the electronics module, preventing sliding and using an attachment mechanism like a pressure membrane or magnet to keep it in place, along with conductive regions on opposing surfaces of the sensing component for improved electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If the electronics module is removably coupled to the wearable article, then ease of operation and communication are improved, but the module may slide out of position due to wearer motion
Solution Approach 1:
The wearable article is divided into separate functional layers: a flexible material layer with integrated sensing components and a removable electronics module. This segmentation allows the module to be easily coupled and decoupled while maintaining stable positioning through the recess structure during wear.
Solution Approach 2:
The electronics module is nested within a recess in the flexible material layer, creating a contained space that restricts movement. The interface elements of the module fit into corresponding recesses in the flexible material, providing mechanical containment without permanent attachment.
2Reliability
If metal fasteners are used to secure the electronics module, then position stability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The patent replaces traditional metal fasteners with a mechanical interference fit system. The recess in the flexible material layer and the corresponding interface elements create a non-metallic mechanical connection that provides sufficient holding force without requiring screws, clips, or other fastening hardware.
Solution Approach 2:
The flexible material layer itself serves as the structural element providing positioning through its recesses. This flexible shell approach eliminates the need for rigid metal fasteners, integrating the positioning function directly into the flexible material structure.
3Reliability
If separate conductive elements are used for electrical connection, then electrical conductivity is improved, but manufacturing complexity and assembly steps increase
Solution Approach 1:
The conductive pathways are merged directly into the flexible material layer during its manufacturing process. This integration eliminates the need for separate conductive elements and their associated assembly steps, reducing manufacturing complexity while maintaining reliable electrical connections.
Solution Approach 2:
The flexible material layer serves multiple functions simultaneously: it provides the structural flexible substrate, contains the recesses for module positioning, and incorporates the conductive pathways for electrical connections. This multi-functionality eliminates the need for separate components for each function.
Data Source
AI summary
A first layer (301) has an outer surface (302) facing away from the wearer and an inner surface (304) facing towards the wearer. The first layer (301) comprises a recess (303a, 303b). A sensing component (100a, 100b) is attached to he inner surface (304) and comprises fabric base component (101) and first and second conductive regions (109a, 109b, 111a, 111b). The base component (101) has an outer surface (105) facing the inner surface (304) and an inner surface (103) facing towards the wearer. The first conductive region (109a, 109b) is provided on the inner surface (103) and forms an electrode. The second conductive region (111a, 111b) is provided on the outer surface (105). The second conductive region (111a, 111b) is aligned with the recess (303a, 303b) in the first layer of material (301) and forms a connection terminal for connecting with an interface element of an electronics module (200).


