Wearable Ring Manufacturing With Detachable PCB and Watertight Sealing
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Solution Overview
Problem
Manufacturing wearable ring devices using epoxy molding processes is tedious, time-consuming, and results in high waste and material costs due to the difficulty in removing hardened epoxy, making component replacement and repair challenging.
Innovation Solution
A manufacturing process for wearable ring devices that does not include epoxy molding, allowing components to be detachably coupled to an inner shell, enabling easy battery replacement and sensor repair, with optical lenses formed within the inner shell before PCB installation, and a cover assembly creating a watertight seal.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If epoxy molding process is used to attach PCB and form lenses, then components are firmly secured and water-tight seal is created, but the process becomes tedious and time-consuming, and component replacement becomes difficult
Solution Approach 1:
The device is divided into separate modular components: an inner shell containing the PCB and lenses, an outer shell, and a battery compartment. These segments are detachably connected, allowing individual components to be replaced without affecting the entire device. The magnetic connection between shells provides secure assembly while enabling easy disassembly for repair.
Solution Approach 2:
Different connection methods are applied to different parts of the device. The PCB and lenses are firmly attached within the inner shell using traditional molding techniques, while the connection between shells uses magnetic forces for detachable coupling. This localized application of different attachment qualities allows secure component mounting while maintaining overall device reparability.
2Strength
If epoxy molding process is used, then components are firmly attached, but waste and material costs increase due to difficulty in removing hardened epoxy
Solution Approach 1:
The PCB assembly with lenses is extracted as a separate module within the inner shell, detachably connected to the outer shell via magnetic forces. This extraction eliminates the need for epoxy molding across the entire device, allowing the PCB module to be removed and replaced without wasting materials, while still providing firm attachment during normal operation.
Solution Approach 2:
The attachment mechanism transitions from permanent chemical bonding (epoxy) to reversible magnetic bonding. By changing the physical parameter of the bonding force from irreversible chemical adhesion to reversible magnetic attraction, the device achieves both strong component attachment and easy removability for repair and material recovery.
3Ease of manufacture
If optical lenses are formed over PCB and components, then lens integration is achieved, but the process becomes more complex and time-consuming
Solution Approach 1:
The lenses are pre-formed and integrated with the PCB assembly within the inner shell before the final assembly with the outer shell. This preliminary integration allows lens manufacturing to be completed independently and in advance, simplifying the overall manufacturing process and enabling parallel production of different components to improve productivity.
Data Source
AI summary
Methods for manufacturing a wearable ring device are described. The method includes detachably coupling a printed circuit board (PCB) to an inner shell to align sensors of the PCB with apertures of the inner shell, where the PCB is disposed between side walls on respective lateral sides of the inner shell. The method further includes disposing a cover assembly around the circumference of the inner shell, where a mechanical deformation of the cover assembly causes the cover assembly to contact the side walls around the circumference of the inner shell, and where the cover assembly is configured to exert a force on the PCB to secure the PCB against the inner shell. The method further includes surrounding at least a portion of the cover assembly with an outer shell, the outer shell defining at least a portion of an outer curved surface of the wearable ring device.