Wearable Sensor Module Stacking to Reduce Biometric Interference
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Solution Overview
Problem
In wearable electronic devices, arranging multiple sensor modules for biometric information acquisition poses challenges in miniaturization due to interference between modules, necessitating an optimized arrangement to reduce interference while maintaining device size.
Innovation Solution
The solution involves stacking or adjacent placement of IC layers with sensor modules, including a first IC layer with a first sensor module and a second IC layer electrically connected to a circuit board, where a processor processes data from both modules, and incorporating light path adjustment members to minimize interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If multiple sensor modules are arranged in a wearable electronic device to acquire more biometric information, then the functionality and information acquisition capability are improved, but the device size increases and interference between modules occurs
Solution Approach 1:
The patent transitions from planar arrangement to three-dimensional stacking of IC layers. Multiple sensor modules are arranged on different IC layers (first IC layer, second IC layer, third IC layer) stacked in the vertical direction, enabling spatial separation that reduces interference while maintaining compact footprint. This vertical dimensionality change allows more sensor modules to be integrated without proportionally increasing device volume.
Solution Approach 2:
The patent implements a nested structure where multiple IC layers containing sensor modules are stacked and integrated within a compact housing. The first IC layer with first sensor module, second IC layer with second sensor module, and third IC layer with third sensor module are nested vertically, with each layer containing its own sensor modules while being integrated into a single compact device structure.
2Volume of moving object
If multiple sensor modules are disposed adjacent to each other to miniaturize the device, then the device size is reduced, but interference between the sensor modules increases
Solution Approach 1:
The patent resolves interference by arranging sensor modules on different vertical levels (different IC layers) rather than adjacent positions in the same plane. The first sensor module, second sensor module, and third sensor module are separated in the vertical dimension through stacked IC layers, eliminating mutual interference while maintaining compact horizontal footprint.
Solution Approach 2:
The patent divides the sensor module integration into separate IC layers, with each IC layer containing specific sensor modules. The first IC layer contains the first sensor module, the second IC layer contains the second sensor module, and the third IC layer contains the third sensor module. This segmentation into discrete layers isolates potential interference sources while enabling compact overall integration.
Data Source
AI summary
A wearable device is provided. The wearable device includes a housing including a transparent part, a circuit board disposed in the housing and including a first surface facing the transparent part and a second surface opposite to the first surface, a first integrated circuit (IC) layer disposed adjacent to the circuit board, a first sensor module, at least a part of which is disposed in the first IC layer, a second sensor module disposed adjacent to the first sensor module, and a second IC layer electrically connected to the first IC layer and the circuit board, and including a processor configured to process data acquired by the first sensor module and the second sensor module, wherein the circuit board, the first IC layer, and the second IC layer are stacked and disposed in a direction perpendicular to the first surface or the second surface of the circuit board.