Wearable Substrate Assembly Layout for Coil Integration and Heat Control
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Solution Overview
Problem
Wearable electronic devices face challenges in efficiently integrating miniaturized components and wireless charging modules while maintaining performance and comfort for user wearability.
Innovation Solution
A wearable electronic device design incorporating a housing with a circuit board assembly and a wireless charging assembly, featuring a first circuit board layer with conductive and non-conductive areas, and a coil assembly for wireless charging, optimized for compactness and efficient power transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If wireless charging module and miniaturized components are integrated into wearable device, then device functionality is enhanced, but device complexity and heat generation increase
Solution Approach 1:
The patent combines the wireless charging coil assembly with the circuit board assembly into a single integrated unit. The coil assembly is positioned in direct contact with the circuit board, eliminating the need for separate mounting structures and reducing overall device complexity while maintaining wireless charging functionality.
Solution Approach 2:
The circuit board serves multiple functions: it provides electrical connections for various sensors and components, supports the wireless charging coil assembly, and acts as a structural element within the housing. This multi-functionality reduces the number of separate components needed, thereby reducing device complexity.
2Adaptability or versatility
If wireless charging module and miniaturized components are integrated into wearable device, then device functionality is enhanced, but heat generation increases
Solution Approach 1:
A thermal interface material is introduced between the wireless charging coil assembly and the circuit board to facilitate heat transfer. This intermediary material efficiently conducts heat away from the charging coil, reducing temperature buildup while maintaining electrical isolation.
Solution Approach 2:
The patent employs thin film thermal management layers within the circuit board structure to dissipate heat generated by the wireless charging module. These thin films provide effective thermal conduction paths without adding significant thickness or complexity to the device.
3Volume of moving object
If components are miniaturized for wearable device, then device size is reduced, but manufacturing precision requirements increase
Solution Approach 1:
The device is divided into modular assemblies (circuit board assembly, coil assembly, sensor modules) that can be manufactured and tested separately before final integration. This segmentation allows each module to be optimized independently, reducing the cumulative precision requirements while achieving compact overall dimensions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the integration of miniaturized components and wireless charging, improving wearability and performance by optimizing power transfer and reducing heat generation.
Implementation Method 1
a coil assembly disposed around the circuit board assembly
Data Source
AI summary
A wearable electronic device according to an embodiment of the present disclosure may comprise a housing, a substrate assembly disposed in the housing, and/or a coil assembly disposed around the substrate assembly. The substrate assembly may comprise a first substrate layer and/or at least one sensor including a plurality of electrical components (for example, photoelectric conversion devices). The first substrate layer may comprise a first conductive region having at least one conductive pattern formed therein and a first non-conductive region formed around the first conductive region. The plurality of electrical components may be arranged along the outer contour of the first substrate layer. The first conductive region may include outer edge portions disposed at the circumferences of the respective electrical components. The first non-conductive region may include at least one slit area disposed in the outer edge portions.