Weaved Connection Transceiver SAW Filter Integration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current wireless communication devices require expensive discrete components like SAW filters, duplexers, and inductors to meet performance standards for 2G and 3G protocols, which are not scalable with advancements in IC fabrication, leading to inefficiencies and increased costs.
Innovation Solution
The development of a SAW-less receiver and transmitter architecture that incorporates frequency translated bandpass filters (FTBPF) and power amplifier drivers, eliminating the need for discrete components by integrating their functionality into a system on a chip (SOC) and front-end module (FEM), allowing for scalable and cost-effective wireless communication solutions.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If discrete components like SAW filters, duplexers, and inductors are used to meet performance standards, then communication performance is improved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent integrates multiple discrete components (SAW filters, duplexers, inductors) into a single integrated circuit that implements frequency translated bandpass filtering. This merging eliminates the need for separate discrete components while maintaining the required filtering performance for 2G and 3G protocols, directly resolving the contradiction between communication performance and device complexity
Solution Approach 2:
The integrated circuit performs multiple functions simultaneously: it provides frequency translation, bandpass filtering, and signal routing capabilities that were previously required from separate discrete components. This multi-functionality reduces the overall component count and device complexity while preserving communication performance across multiple wireless standards
2Reliability
If discrete components like SAW filters, duplexers, and inductors are used to meet performance standards, then communication performance is improved, but manufacturing cost increases
Solution Approach 1:
By combining multiple discrete components into a single integrated circuit, the patent enables standard IC fabrication processes to be used instead of assembling multiple discrete components. This merging significantly reduces manufacturing cost while maintaining the communication performance required for 2G and 3G protocols
Solution Approach 2:
The patent changes the implementation approach from discrete component values to integrated circuit parameters, allowing frequency translation and filtering characteristics to be programmed or configured within the IC. This parameter change enables cost-effective mass production through standard IC fabrication while maintaining required performance levels
3Reliability
If traditional receiver architecture with discrete components is used, then performance standards are met, but scalability with IC fabrication advancements is limited
Solution Approach 1:
The integrated circuit allows filtering and frequency translation parameters to be adjusted or reconfigured, enabling the same hardware platform to adapt to different wireless communication standards and frequency bands. This scalability is achieved through parameter changes rather than requiring different discrete component assemblies, allowing the design to evolve with IC fabrication advancements
Data Source
AI summary
A transceiver includes a local oscillation module, a transmitter section, and a receiver section. The local oscillation module is operable to generate a transmit local oscillation and a receive oscillation. The transmitter section includes a transmit mixing module and a transmit weaved connection that is operable to high frequency filter the transmit location oscillation. The transmit mixing module mixes the filtered transmit location oscillation with a transmit signal to produce an up-converted signal. The receiver section includes a receive mixing module and a receive weaved connection that is operable to high frequency filter the receive location oscillation. The receive mixing module mixes the filtered receive location oscillation with an RF received signal to produce a down-converted signal.