Two-Piece Wedge Clamp Assembly for Electronics Module Heat Transfer

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Solution Overview

Problem

Existing thermal mechanical interfaces struggle to efficiently manage heat dissipation from electronics modules, leading to overheating issues as electronics become more powerful.

Innovation Solution

A two-piece wedge clamp assembly with sawtooth surfaces on opposing wedge plates, allowing for adjustable pressure and increased contact area, which secures an electronics module to a chassis while providing enhanced thermal conductivity and heat transfer.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Stress or pressure

If a traditional single-piece clamp is used, then the device complexity is low, but the contact pressure and contact area are insufficient for effective thermal management

Engineering Contradiction:

Improvecontact pressureVSAvoiddevice complexity

Core Design Contradiction:

Stress or pressureVSDevice complexity

Solution Approach 1:

The clamp is divided into two separate wedge plates (first wedge plate and second wedge plate) that can be independently adjusted and positioned. This segmentation allows each plate to apply pressure independently, increasing the overall contact pressure with the electronics module while maintaining manageable device complexity through modular construction.

Inventive Principle:

Principle #1Segmentation

2Area of stationary object

If a traditional single-piece clamp is used, then the device complexity is low, but the contact area is insufficient for effective heat transfer

Engineering Contradiction:

Improvecontact areaVSAvoiddevice complexity

Core Design Contradiction:

Area of stationary objectVSDevice complexity

Solution Approach 1:

The clamp is divided into two separate wedge plates (first wedge plate and second wedge plate) that can be independently adjusted and positioned. This segmentation allows each plate to contribute to the total contact area, effectively doubling the potential contact surface area with the electronics module compared to a single-piece design.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The two wedge plates are positioned on opposite sides of the electronics module, utilizing the third dimension (depth/thickness of the module) to create additional contact surfaces. This dimensional approach allows heat transfer from both sides of the module simultaneously, effectively increasing the total contact area without increasing the footprint.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

3Temperature

If existing hardware is modified to improve thermal management, then the heat dissipation efficiency improves, but the ease of operation and installation deteriorates

Engineering Contradiction:

Improvemodule temperatureVSAvoidease of operation

Core Design Contradiction:

TemperatureVSEase of operation

Solution Approach 1:

The wedge clamp assembly is designed to be installed and adjusted without modifying the existing electronics module or chassis. The adjustable mechanism allows users to independently position the wedge plates to achieve optimal contact pressure and area, enabling self-adjustment for different module configurations without requiring technical expertise or hardware modifications.

Inventive Principle:

Principle #25Self-service

4Adaptability or versatility

If a fixed-pressure clamp is used, then the device complexity is low, but the adaptability to different electronics modules is insufficient

Engineering Contradiction:

Improveadaptability to different modulesVSAvoiddevice complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The clamp incorporates an adjustable mechanism that allows the position and pressure of the two wedge plates to be dynamically modified. This enables the same clamp assembly to adapt to different electronics module sizes, shapes, and thermal requirements by independently positioning each wedge plate, providing versatility without requiring multiple specialized clamps for different applications.

Inventive Principle:

Principle #15Dynamics

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The wedge clamp assembly achieves up to 50% greater contact pressure and 240% larger contact area, reducing module temperatures by up to 10°C compared to existing designs, effectively managing thermal management without modifying existing hardware.

Implementation Method 1

providing enhanced thermal conductivity and heat transfer

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12557231B2Two-piece separable wedge clamp for thermal mechanical interface

Publication Date: 2026.02.17 BAE SYSTEMS INFORMATION ANDELECTRONIC SYSTEMS INTEGRATION INC

AI summary

A wedge clamp assembly includes a first wedge plate including a first planar surface, and a first sawtooth surface opposite the first planar surface. The first wedge plate is configured to be fixed with respect to an electronics module. The first sawtooth surface includes two or more inclined faces with respect to the first planar surface. The wedge clamp assembly further includes a second wedge plate including a second planar surface and a second sawtooth surface opposite the second planar surface. The second wedge plate is adjustable with respect to the first wedge plate. The second sawtooth surface includes two or more inclined faces with respect to the second planar surface. An angle of incline of the inclined faces of the first sawtooth surface is equal to or substantially equal to an angle of incline of the inclined faces of the second sawtooth surface.