Wedge-Pressed Cooling Plate for Power Module Heat Dissipation
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Solution Overview
Problem
Existing electrical devices face challenges in efficiently dissipating heat from power semiconductor switches without relying on heat-transfer compounds, and manufacturing tolerances can lead to instability and increased repair costs.
Innovation Solution
A cup-shaped housing with a wedge mechanism that presses a cooling plate against the housing part, allowing for effective heat dissipation without compounds, and a plastic member surrounding the printed-circuit board for mechanical protection and improved thermal conductivity, enabling efficient heat transfer and easy assembly.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If heat-transfer compound is introduced to improve heat transfer, then heat dissipation efficiency is improved, but device complexity and environmental harm increase
Solution Approach 1:
The invention extracts and eliminates the heat-transfer compound from the system by using a cooling plate with a heat-conducting surface that directly contacts the heat-generating component. This removes the need for additional substances while maintaining effective heat transfer from the power semiconductor switches to the housing.
Solution Approach 2:
The cooling plate acts as an intermediary element between the heat-generating component and the housing. It provides a dedicated heat-conducting surface that facilitates thermal transfer without requiring heat-transfer compounds, thus simplifying the system and reducing environmental harm.
2Reliability
If manufacturing tolerances are not compensated, then production is simpler, but connection stability and reliability deteriorate
Solution Approach 1:
The wedge mechanism introduces a dynamic adjustment capability to the otherwise static connection between the cooling plate and housing. By allowing the cooling plate to be pressed with adjustable force, the system compensates for manufacturing tolerances and ensures stable thermal contact without requiring overly precise manufacturing.
3Reliability
If the entire device is replaced upon defect, then reliability is restored, but environmental harm and cost increase
Solution Approach 1:
The invention segments the device into a replaceable cartridge containing the power electronics and a permanent housing. This allows only the defective cartridge to be replaced while the housing remains in use, reducing waste and environmental harm while restoring system reliability.
Solution Approach 2:
The housing is recovered and retained for continued use after the power electronics fail. Only the cartridge needs to be discarded and replaced, thereby reducing material waste and environmental impact compared to replacing the entire device.
4Temperature
If the cooling plate is not firmly pressed against the housing, then assembly is easier, but heat transfer efficiency deteriorates
Solution Approach 1:
The wedge mechanism provides dynamic adjustability in the pressing force applied to the cooling plate. This allows the assembly to be easily put together while still achieving firm contact for efficient heat transfer, as the pressing force can be adjusted during assembly to compensate for tolerances.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides a simple, efficient, and cost-effective method for heat dissipation, reduces manufacturing tolerances, and allows for easy replacement of cartridges, improving environmental protection and reducing repair expenditures by maintaining the housing during component exchanges.
Implementation Method 1
a cooling plate connected to the printed-circuit board being pressed against the inner wall of the housing part by a wedge
Implementation Method 2
heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part
Data Source
AI summary
An electrical device includes a printed-circuit board which is fitted with heat-generating components, the printed-circuit board being disposed in a housing of the device, the housing having a housing part, particularly a cup-shaped housing part, and a cooling plate connected to the printed-circuit board being pressed by a wedge against the inner wall of the housing part, in particular, being pressed such that heat from at least one heat-generating component, especially a power module having power semiconductor switches, is able to be dissipated at a contact surface to the housing part.