Wedge Lock Thermal Conduction for Single Board Computers
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Solution Overview
Problem
Conduction cooled circuit boards have limited heat dissipation capabilities due to a single thermal path, which can lead to component overheating, reduced lifespan, and reliability issues in densely populated electrical assemblies.
Innovation Solution
A wedge lock apparatus is integrated with a single board computer that includes a thermal conductance plate and a clamp device with sawtooth portions, allowing for additional heat conduction paths and reduced thermal resistance, enabling increased heat dissipation through a combination of cooling plate and heat conductance plate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single thermal path is used for heat dissipation, then the device structure is simple, but the heat dissipation capability is limited
Solution Approach 1:
The thermal management system is segmented into multiple independent thermal paths: a first thermal path through the cooling plate and a second thermal path through the heat conductance plate. This segmentation allows heat to be dissipated through multiple parallel routes, increasing overall heat dissipation capability without significantly complicating the device structure.
Solution Approach 2:
The invention adds a dimensional aspect to thermal management by introducing a second thermal path that operates in parallel with the first thermal path. This multi-dimensional thermal conduction approach transforms the single-path linear heat dissipation into a multi-path network, enhancing heat dissipation capability.
2Temperature
If heat dissipation capability is increased through additional thermal paths, then temperature control improves, but device complexity increases
Solution Approach 1:
The cooling plate and heat conductance plate are merged into a unified thermal management system where both components work simultaneously to dissipate heat. The wedge lock mechanism merges structural support and thermal conduction functions, eliminating the need for separate fastening hardware and reducing overall device complexity.
Solution Approach 2:
The wedge lock serves multiple functions: it provides mechanical support for the circuit board, applies clamping force for thermal contact, and acts as part of the thermal conduction path. This multi-functionality reduces the number of separate components needed, maintaining simple device structure while improving temperature control.
3Reliability
If wedge lock is used to secure the computer, then shock and vibration resistance improves, but thermal resistance increases
Solution Approach 1:
The wedge lock is constructed from a thermally conductive material that combines mechanical strength with thermal conduction properties. This composite approach allows the same component to provide both shock and vibration resistance while simultaneously serving as an effective thermal conduction path, reducing thermal resistance rather than increasing it.
Solution Approach 2:
The heat conductance plate acts as an intermediary thermal conduction path that complements the wedge lock's mechanical support function. This intermediary component provides an additional thermal pathway that works in parallel with the wedge lock, reducing overall thermal resistance while the wedge lock maintains its shock and vibration resistance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively lowers the operating temperature of the printed circuit board, increases its usable lifetime, and reduces maintenance needs by providing dual thermal paths for heat dissipation, thereby enhancing the reliability and performance of the single board computer.
Implementation Method 1
Heat generated by PCB 102 is conducted by cooling plate 106 to side bar 104 and wedge lock 108
Implementation Method 2
wedge lock 108 secures computer 100 against shock and vibration that may be encountered in the operating environment
Data Source
Figure 1~2
Figure 3~4
Figure 5
AI summary
A wedge lock for use with a single board computer includes a cooling plate positioned with respect to a printed circuit board (PCB), a clamp device configured to secure the single board computer in an operating environment, and a heat conductance plate positioned along a top surface of the cooling plate and a top surface of the clamp device to facilitate conduction cooling of the PCB.