Wedge Lock Thermal Path Expansion for Conduction Cooling
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Solution Overview
Problem
Existing conduction cooled circuit boards face inefficiencies in heat transfer due to small contact surface areas of wedge locks with heat management layers, leading to increased thermal resistance and reduced reliability in high-stress environments.
Innovation Solution
The design of a wedge lock with an increased surface area of direct contact between the wedge lock and card guides, optimizing multiple thermal paths for heat transfer and securing the single board computer, which reduces thermal resistance and enhances conductive cooling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wedge locks are used to secure circuit boards and conduct heat, then the circuit board is secured and heat is conducted away, but the small contact surface area focuses heat into a narrow thermal path that increases thermal resistance and reduces cooling efficiency
Solution Approach 1:
The wedge lock is merged with a heat sink component, combining the mechanical fastening function with the thermal management function into a single integrated component. This allows the wedge lock to provide both secure mounting and effective heat dissipation simultaneously.
Solution Approach 2:
The contact surface area of the wedge lock is dramatically increased by extending the heat management layer laterally along the circuit board edges. This transforms the thermal path from a narrow one-dimensional path through the wedge lock to a broad two-dimensional conduction path through the extended heat management layer and heat sinks.
2Temperature
If convection cooled circuit boards use fans to blow cooling air, then heat is removed from the circuit board, but fans can be shaken by shock and vibration, overheat, and collect dust that lessens air output
Solution Approach 1:
The passive conduction cooling system replaces the active mechanical fan-based convection cooling system. Heat is removed through direct thermal conduction to heat sinks and heat pipes rather than through forced air convection requiring mechanical fans, eliminating the reliability issues associated with fans in high-vibration environments.
Solution Approach 2:
The cooling system operates passively without requiring external power or mechanical actuation. Heat naturally conducts from the circuit board through the heat management layer to the heat sinks and heat pipes, which then dissipate heat to the environment without requiring fan-driven air flow.
3Ease of operation
If conduction cooled circuit boards use wedge locks with small contact surface areas, then the circuit board is secured, but thermal resistance increases and heat conduction efficiency decreases
Solution Approach 1:
The heat management layer extends laterally along the edges of the circuit board, transforming the thermal contact from a small point-contact through the wedge lock to a large surface-area contact along the board edges. This dimensional expansion of the thermal path dramatically reduces thermal resistance.
Solution Approach 2:
The extended heat management layer serves multiple functions: it provides mechanical support and positioning for the circuit board while simultaneously creating large-area thermal conduction paths to multiple heat sinks, combining structural and thermal management functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach effectively increases heat transfer efficiency and reliability by expanding the contact surface area, reducing thermal resistance, and ensuring secure mounting within harsh environments.
Implementation Method 1
facilitates optimizing an area of one or more thermal paths through which heat is transferred away from the electronic device by increasing a surface area of direct contact between a wedge lock and a card guide that provides conductive heat transfer away from the electronic device
Data Source
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AI summary
A wedge lock for use with a single board computer includes a first portion configured to move in a first direction and a second portion configured to move in a plurality of directions in response to the movement of the first portion and to facilitate securing the single board computer in an operating environment and to facilitate conduction cooling of the single board computer.