Wedge-Shaped Gas Injector Inserts for Spatial ALD
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Solution Overview
Problem
In semiconductor wafer processing, especially in spatial ALD processing chambers, there is a need to improve the separation of process gases to prevent gas phase mixing and reaction byproducts from interfering with the deposition process, leading to non-uniformity and lack of conformality in film deposition.
Innovation Solution
The use of wedge-shaped gas injector inserts with specific slot configurations and fluid communication designs that provide high-velocity gas flows and vacuum channels to create gas curtains, ensuring precise delivery and removal of reactive gases and byproducts, thereby minimizing gas phase reactions and enhancing deposition uniformity and conformality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If spatial ALD processing chamber is used for deposition, then film thickness control and conformality are improved, but gas phase mixing of reactive gases occurs leading to non-uniformity
Solution Approach 1:
The gas distribution assembly is divided into multiple separate gas delivery channels, each dedicated to delivering a specific reactive gas. This segmentation prevents different reactive gases from mixing in the gas phase while maintaining spatial separation for conformal deposition in high-aspect ratio structures.
Solution Approach 2:
The patent implements localized gas delivery through precisely positioned gas injection points and flow control mechanisms that deliver reactive gases directly to specific regions of the substrate. This local quality approach ensures that each reactive gas reaches its intended target area without mixing, maintaining both conformality and preventing unwanted gas phase reactions.
2Manufacturing precision
If multiple chambers are used for sequential processing, then film conformality is improved, but processing time increases
Solution Approach 1:
The patent combines multiple gas delivery functions and process steps into a single integrated gas distribution assembly. By merging the delivery of multiple reactive gases and purge functions into one chamber with precisely controlled flow paths, the system achieves conformal deposition without requiring multiple separate chambers, thus reducing processing time while maintaining film quality.
Solution Approach 2:
The gas distribution assembly enables continuous sequential delivery of different reactive gases to the substrate without interrupting the deposition process. The optimized flow paths and pressure control allow for continuous alternation between different gas phases, maintaining conformal deposition while maximizing substrate processing throughput.
3Object-affected harmful factors
If gas curtains are used to separate process regions, then gas separation is improved, but reaction byproducts are dragged through curtains causing contamination
Solution Approach 1:
The patent extracts and removes reaction byproducts through dedicated exhaust ports and vacuum channels positioned strategically within the gas distribution assembly. By taking out byproducts at their source before they can be dragged through gas curtains, the system maintains effective gas separation while preventing contamination of subsequent process regions.
Solution Approach 2:
The gas distribution assembly acts as an intermediary between reactive gas delivery and substrate processing, incorporating intermediate purification zones and byproduct removal channels. This intermediary structure captures and removes reaction byproducts before they can contaminate other process regions, while still maintaining the gas curtains needed for spatial separation.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively prevents gas mixing and byproduct interference, resulting in higher uniformity and conformality of film deposition, especially beneficial for thin films and high aspect ratio features, while also reducing parasitic CVD and in-film contaminants.
Implementation Method 1
Gas flowing through the first slot exits the housing at supersonic velocity
Data Source
AI summary
Gas injector inserts having a wedge-shaped housing, at least one first slot and at least one second slot are described. The housing has a first opening in the back face that is in fluid communication with the first slot in the front face and a second opening in the back face that is in fluid communication with the second slot in the front face. Each of the first slot and the second slot has an elongate axis that extends from the inner peripheral end to the outer peripheral end of the housing. The gas injector insert is configured to provide a flow of gas through the first slots at supersonic velocity. Gas distribution assemblies and processing chambers including the gas injector inserts are described.