Wedge Bonding Tool Structure for Press Force Inspection
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Solution Overview
Problem
Conventional wedge bonding methods for semiconductor devices suffer from reduced inspection accuracy due to the reliance on visual appearance inspection of deformed metal wires, which can lead to incorrect determination of press force on the bonded body, and potential damage from excessive force.
Innovation Solution
A wedge tool with a wire holding groove and convex parts on the groove bottom that form contact marks on the metal wire during bonding, allowing for inspection based on these marks to determine appropriate press force.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of operation
If appearance shape of deformed metal wire is used as inspection index, then inspection can be performed by optical microscope or image recognition, but inspection accuracy is reduced due to fluctuations in determination
Solution Approach 1:
The patent applies the principle of visual change by creating contact marks on the metal wire surface through convex parts. These marks serve as distinct visual indicators that change the surface appearance in a controlled manner, enabling accurate inspection. The contact marks provide clear visual cues that are not affected by variations in light intensity or wire deformation, thus resolving the contradiction between ease of optical inspection and inspection accuracy.
2Reliability
If press force is increased to suppress slip of wedge tool and metal wire, then bonding properties are improved, but bonded body may be damaged
Solution Approach 1:
The patent applies local quality by providing convex parts at specific locations on the wedge tool surface. These convex parts create localized contact marks on the metal wire that indicate the distribution and magnitude of press force. This allows optimization of press force application - sufficient to prevent slip and ensure bonding reliability, but controlled to avoid excessive force that would damage the bonded body. The contact marks serve as visual feedback for force control.
Solution Approach 2:
The patent implements feedback by using contact marks as visual indicators of press force magnitude. The presence, depth, and pattern of contact marks provide immediate feedback on whether the press force is appropriate. This feedback mechanism enables operators to adjust press force to achieve optimal bonding without damaging the bonded body, resolving the contradiction between bonding reliability and prevention of damage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method allows for accurate determination of press force by inspecting contact marks, thereby reducing inspection inaccuracies and preventing excessive force application, enhancing the reliability of semiconductor device manufacturing.
Implementation Method 1
wedge bonding of pressing a metal wire and applying ultrasonic vibration, thereby bonding the metal wire to a bonded body
Data Source
AI summary
A wedge tool according to one aspect of the present disclosure is a wedge tool used for wedge bonding of pressing a metal wire and applying ultrasonic vibration, thereby bonding the metal wire to a bonded body, including: a wire holding groove extending along a longitudinal direction of the metal wire in a tip end portion of the wedge tool and holding the metal wire; and at least two convex parts formed in a groove bottom part of the wire holding groove and having a side surface located away from a sidewall of the wire holding groove and arranged in the longitudinal direction of the metal wire.