Wedge Bonding Tool Tip Geometry for Stable Stacked Wire Bonds
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Solution Overview
Problem
Existing wedge bonding tools lack features that enhance the stability and reliability of stacked wire bonds, particularly in terms of electrical cross-sectional area and maximum current carrying capacity without increasing wire size or bond pad dimensions.
Innovation Solution
The development of wedge bonding tools with specific geometric features at the tip portion, such as grooves with flat areas, protrusions, and convex or concave surfaces, which improve the grip and shaping of wires during bonding, allowing for stable stacking of wire bonds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If conventional wedge bonding tools without a flat area are used, then the tool structure is simpler, but the stability of stacked wire bonds deteriorates
Solution Approach 1:
The patent applies local quality by introducing a flat area at the tip of the wedge bonding tool specifically for wire bond stacking, while the rest of the tool maintains its conventional wedge shape. This localized modification provides the necessary stability for stacked wire bonds without unnecessarily complicating the overall tool structure.
Solution Approach 2:
The tool tip is segmented into distinct functional zones: the flat area for stable wire bond stacking and the opposing wedge walls for maintaining the bonding geometry. This segmentation allows each portion to perform its specific function optimally.
2Quantity of substance
If larger wire sizes are used, then the electrical cross-sectional area increases, but the device dimensions and bond pad sizes must also increase
Solution Approach 1:
The patent changes the geometric parameters of the bonding tool by introducing a flat area with specific width proportions (at least 20% of the groove width at the working end). This parameter change enables better control over wire bond stacking, allowing increased electrical cross-sectional area through improved bonding geometry rather than simply increasing wire diameter.
3Stability of the object's composition
If the flat area width is less than 20% of the groove width, then the tool structure is more compact, but the stability of stacked wire bonds is insufficient
Solution Approach 1:
The patent establishes a specific parameter threshold for the flat area width (at least 20% of the groove width at the working end) to ensure adequate stability for wire bond stacking. This quantitative parameter definition provides a clear design criterion that balances tool compactness with bonding stability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enhances the stability of stacked wire bonds, increasing electrical cross-sectional area and maximum current carrying capacity without requiring larger wire sizes or bond pad dimensions, thereby improving the reliability of electrical connections.
Implementation Method 1
a groove configured to receive a wire... transferring the tool tip motion from the wedge bonding tool to the wire during formation of a wire bond
Implementation Method 2
The flat area has a width of at least 20% of a width of the groove at the working end, providing a stable surface for stacking wire bonds
Data Source
AI summary
A wedge bonding tool is provided. The wedge bonding tool includes a body portion including a tip portion, the tip portion terminating at a working end of the wedge bonding tool. The tip portion includes (i) two opposing walls, and (ii) an adjoining surface between the two opposing walls. The adjoining surface includes a flat area. The two opposing walls and the flat area define a groove configured to receive a wire. The flat area has a width of at least 20% of a width of the groove at the working end.