Weld Positioning Clip Posts for Uniform Cable Joint Encapsulation

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Solution Overview

Problem

The challenge in the encapsulation process is maintaining the correct position of exposed cable joints within a mould to ensure uniform thickness of the encapsulation sealant, as incorrect positioning can lead to insufficient insulation, and existing solutions like oversized mould cavities result in suboptimal designs and packaging issues.

Innovation Solution

A positioning clip with a loop-shaped body and outwardly extending posts is used to engage around the exposed conducting core of a cable, maintaining a minimum spacing between the clip and the mould, ensuring adequate encapsulation sealant thickness while allowing for sealant flow and preventing air pockets.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the mould cavity is made oversized to minimise the risk of insufficient encapsulation material thickness, then the insulation thickness is improved, but the join size becomes oversized causing packaging issues and fitting problems

Engineering Contradiction:
Improveencapsulation material thicknessVSAvoidjoin size
Core Design Contradiction:
Manufacturing precisionVSVolume of moving object

Solution Approach 1:

The positioning function is segmented from the mould cavity and transferred to a separate positioning clip that engages around the cable core. This allows the mould cavity to be optimally sized while the clip provides the spacing function through its posts that engage with the mould inner surface.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

The positioning clip acts as an intermediary component between the cable core and the mould. The clip's body engages around the core while its posts engage with the mould inner surface, mediating the spacing relationship and ensuring adequate encapsulation material thickness without requiring an oversized mould cavity.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Device complexity

If the splice position in the mould is not controlled, then the device complexity is reduced, but the insulation reliability deteriorates due to insufficient thickness

Engineering Contradiction:
Improvepositioning mechanismVSAvoidinsulation reliability
Core Design Contradiction:
Device complexityVSReliability

Solution Approach 1:

The positioning clip is prepared in advance with posts of specific lengths that correspond to the required minimum spacing. Before the encapsulation process, the clip is engaged around the cable core, preliminarily establishing the correct position and spacing, so that when encapsulation material is injected, the spacing is already guaranteed.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The positioning clip is self-positioning through its geometric features. The posts engage with the mould inner surface at predetermined locations, and the clip's body engages around the cable core, creating a self-contained positioning system that automatically ensures correct spacing without requiring complex external positioning mechanisms.

Inventive Principle:
Principle #25Self-service

Data Source

PatentEP4258498A1Weld positioning clip for encapsulation process
Publication Date: 2023.10.11 APTIV TECHNOLOGIES AG
  • EP4258498A1 patent drawingFigure 1~3
  • EP4258498A1 patent drawingFigure 4~5
  • EP4258498A1 patent drawingFigure 6~8

AI summary

A cable clip 1 for engaging around an exposed conducting core of a cable 9, 10 during an encapsulation process. The clip 1 is formed as a rectilinear loop having an inner surface 1b and an outer surface 1a and opposed ends which define an opening 5 in the loop there between by mean of which the clip 1 can be engaged around said exposed core 11. The clip 1 has posts 6 distributed around, and extending outwardly from, its outer surface 1a. The posts 6 engage with an inner surface if an encapsulation mould 13 enclosed around the clip 1 so as to maintain a minimum spacing between the mould 13 and the outer surface of the body around the entire clip and thereby ensure a minimum thickness of encapsulation sealant 12 is formed around the exposed core of the cable 9, 10 during the encapsulation process.