Weldable Inserts for Optical Subassembly Alignment
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Solution Overview
Problem
Parallel optical communications devices face challenges in securing optical subassemblies (OSA) to electrical subassemblies (ESA) without relative movement, which can lead to loss of precise optical alignment and heat dissipation issues due to weak adhesive bonds and external forces.
Innovation Solution
The use of weldable inserts on both the ESA and OSA, which are welded together to form a strong joint, preventing relative movement and ensuring precise alignment while allowing for effective heat dissipation through high thermal conductivity materials.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If adhesive material is used to secure OSA to ESA, then the device can be assembled easily, but the bond strength is insufficient to prevent relative movement under external forces
Solution Approach 1:
The bonding interface is segmented into discrete weldable inserts embedded within the OSA and ESA structures, allowing localized strong bonding points rather than relying on a continuous adhesive layer. This segmentation provides concentrated strength at critical interfaces while simplifying the overall assembly process.
Solution Approach 2:
The adhesive bonding mechanism is replaced with a welding mechanism for the critical structural connection. The weldable inserts provide a metallurgical bond that is significantly stronger than adhesive bonds, while the welding process itself is integrated into the manufacturing flow to maintain ease of manufacture.
2Stability of the object's composition
If strong adhesive bonds are used to prevent relative movement, then alignment stability is improved, but heat dissipation is compromised due to thermal resistance of adhesive materials
Solution Approach 1:
The connection structure is segmented to separate the bonding function from the heat dissipation function. Weldable inserts provide the strong bonding for alignment stability, while the surrounding metal structures and interfaces provide thermal conduction pathways that are not present in adhesive-based designs.
Solution Approach 2:
The bonding mechanism is changed from adhesive-based to welding-based, fundamentally altering the thermal and mechanical properties of the joint. Welding creates a metallurgical bond with superior thermal conductivity compared to adhesive materials, simultaneously improving both alignment stability and heat dissipation.
3Temperature
If external forces are applied to attach heat sink devices, then heat dissipation is improved, but relative movement between OSA and ESA occurs due to weak bonds
Solution Approach 1:
The weldable inserts are pre-positioned and welded together before the attachment of heat sink devices or other external components. This preliminary bonding creates a rigid, movement-free foundation that can subsequently withstand the forces applied during heat sink attachment without experiencing relative movement between OSA and ESA.
Solution Approach 2:
The adhesive bond is replaced with a welded joint that has sufficient strength to withstand the mechanical forces applied during heat sink device attachment. The welding process creates a permanent, rigid connection that eliminates the creeping and relative movement problems associated with adhesive bonds under load.
4Manufacturing precision
If adhesive material is used for securing components, then manufacturing process is simple, but precise optical alignment cannot be maintained over time
Solution Approach 1:
The adhesive securing mechanism is replaced with a welding mechanism that provides permanent, rigid fixation. This eliminates the gradual degradation and creeping that occurs with adhesive bonds over time, maintaining precise optical alignment throughout the device lifetime. The welding process, while requiring specialized equipment, is integrated into the manufacturing flow.
Solution Approach 2:
Precise optical alignment is achieved and then permanently locked in place through welding of the inserts before any subsequent assembly steps. This preliminary alignment and bonding sequence ensures that the precise positioning is maintained without the risk of later degradation that would occur with adhesive-based systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The welded joint provides structural strength to maintain precise optical alignment and withstand external forces, while the high thermal conductivity materials enhance heat dissipation, improving the overall performance and reliability of parallel optical communications devices.
Implementation Method 1
The weldable ESA insert and the weldable OSA insert are welded together to form at least one welded joint between the OSA and the ESA
Implementation Method 2
The heat dissipation block has at least one slot formed in a lower surface thereof and at least one weldable OSA insert contained in the slot. The lower surface of the heat dissipation block is in at least partial contact with the upper surface of the mounting device
Data Source
AI summary
A parallel optical communications device is provided that has an OSA that includes at least one heat dissipation block having a slot formed in a lower surface thereof that contains a weldable insert. Likewise, an upper surface of the mounting device of the ESA has at least one slot formed therein that contains a weldable insert. After the OSA is placed in contact with the ESA and optically aligned with the ESA, the OSA is secured to the upper surface of the mounting device of the ESA by welding together the respective weldable inserts contained in the respective slots in the OSA and in the mounting device of the ESA. The welding process results in an extremely strong welded joint between the OSA and the ESA that prevents relative movement between the OSA and the ESA if external forces that are exerted on the OSA and/or on the ESA.