Weldable Strain Sensor Assembly with Stand-Off Gap
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Solution Overview
Problem
Thin film strain sensors face reduced throughput in batch vacuum processing due to the need for batch processing in fixed-volume vacuum chambers, and existing attachment methods can degrade sensor performance through friction and environmental changes.
Innovation Solution
A weldable strain sensor assembly comprising a stand-off, substrate, and sensing component, where the stand-off and substrate suspend the sensing component over the instrumented component with a defined gap, reducing friction and allowing for a more efficient welding process that minimizes performance degradation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If batch processing is used in fixed-volume vacuum chambers, then thin film strain sensors can be manufactured, but the throughput is reduced and processing time increases
Solution Approach 1:
The sensor assembly is divided into separate components (sensing component, substrate, stand-off) that can be independently processed and then assembled, enabling more efficient batch processing in vacuum chambers
2Ease of manufacture
If existing attachment methods are used to join the sensor to the component, then the sensor can be attached, but friction and environmental changes degrade sensor performance
Solution Approach 1:
The sensing component is extracted and suspended above the instrumented component with a defined gap, eliminating direct contact and thereby removing friction and environmental degradation pathways while maintaining attachment capability through the substrate and stand-off structure
Solution Approach 2:
The substrate and stand-off act as intermediary elements between the sensing component and the instrumented component, allowing mechanical attachment while preventing direct interaction that would cause friction and performance degradation
Data Source
AI summary
A weldable strain sensor assembly configured to be joined to an instrumented component includes: a stand-off; a substrate disposed on top of the stand-off; and a sensing component disposed on a top or a bottom of the substrate; wherein the combination of the stand-off and the substrate are configured to suspend the sensing component over the instrumented component with a defined gap between the instrumented component and at least one of: the substrate; and, the sensing component.