Welded Bellows for Semiconductor Devices
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Solution Overview
Problem
Accordion-shaped welded metal bellows used in semiconductor-manufacturing devices are prone to premature failure due to bending deformation caused by foreign matter ingress, leading to reduced service life and loss of sealing functionality.
Innovation Solution
A double-layer structured welded bellows with a thick processing-side plate and a thin non-processing-side plate, separated by a gas layer, where the processing-side plate serves as both a sealing and reinforcing member, and the non-processing-side plate is designed for flexibility to compensate for any damage, ensuring continued sealing functionality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single-layer bellows plate structure is used, then the device complexity is reduced, but the reliability deteriorates due to premature failure from bending deformation caused by foreign matter ingress
Solution Approach 1:
The bellows plate is divided into two separate layers: a processing-side bellows plate and a non-processing-side bellows plate. Each layer serves a specific function - the processing-side plate provides sealing and reinforcement, while the non-processing-side plate absorbs bending deformation. This segmentation allows the system to maintain reliability without excessive complexity by distributing functions across distinct components.
Solution Approach 2:
Different regions of the bellows structure are assigned different thicknesses and material properties. The processing-side bellows plate is made thicker with higher strength to resist foreign matter and maintain sealing, while the non-processing-side bellows plate is made thinner to flexibly absorb bending deformation. This local differentiation of properties optimizes both reliability and functional performance.
2Strength
If the bellows plate is made thicker to resist foreign matter, then the strength is improved, but the flexibility deteriorates
Solution Approach 1:
The bellows structure is segmented into two functional layers with different thicknesses. The processing-side bellows plate is thicker to provide strength and foreign matter resistance, while the non-processing-side bellows plate is thinner to maintain flexibility and accommodate bending deformation during operation.
Solution Approach 2:
Different thicknesses are applied to different sides of the bellows structure based on local functional requirements. The processing-side requires higher strength and is made thicker, while the non-processing-side requires flexibility and is made thinner. This local quality differentiation resolves the contradiction between strength and flexibility.
3Object-affected harmful factors
If foreign matter enters between the bellows plates, then the bending deformation increases, but the service life reduces due to crack formation
Solution Approach 1:
The non-processing-side bellows plate is designed as a sacrificial element that absorbs bending deformation caused by foreign matter ingress before cracks can propagate to the processing-side bellows plate. This beforehand cushioning protects the critical sealing surface and extends the service life of the bellows assembly.
Solution Approach 2:
The non-processing-side bellows plate is designed to be replaceable and sacrificial, absorbing the damage from foreign matter ingress. When this plate fails, it can be replaced without replacing the entire bellows assembly or the critical processing-side plate, thereby extending the overall service life cost-effectively.
Data Source
AI summary
An accordion-structured welded bellows for a semiconductor-manufacturing device is characterized in that a plurality of annular bellows plates having curved surfaces in a radial direction are connected in an alternating fashion on the outside-diameter side and the inside-diameter side, wherein the annular bellows plates have a processing-side bellows plate and a non-processing-side bellows plate, a gas layer is interposed between the two bellows plates, the processing-side bellows plate is configured as a thick plate, and the non-processing-side bellows plate is configured as a thin plate. The welded bellows is less likely to be damaged by foreign matter and to be able to use the non-processing-side bellows plate to compensate for any damage to the processing-side bellows plate.