Welded Frame Punch-Shaping for Surface Planarization

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

The conventional method of polishing welded metal frames in liquid-crystal televisions results in surface sinking and reduces the thickness of the welded portions, leading to inefficiencies in the manufacturing process.

Innovation Solution

A method involving punch-shaping of the welded portions between frame members using a punch pin and base, which planarizes the seams without removing material, allowing for rapid shaping and preventing surface sinking during the punch-bending process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the welded portions are planarized by polishing, then the surface smoothness is improved, but the thickness of the welded portion is reduced and surface sinking occurs

Engineering Contradiction:
Improvesurface smoothnessVSAvoidthickness of welded portion
Core Design Contradiction:
Manufacturing precisionVSStrength

Solution Approach 1:

The invention applies preliminary action by planarizing the welded portions before the punch-bending process. The punch-shaping is performed in advance to create a planar surface on the welded portions, preventing surface sinking from occurring during subsequent punch-bending operations. This preliminary planarization eliminates the need for post-processing polishing that would remove material.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The invention applies inversion by reversing the conventional sequence and approach: instead of welding first then planarizing through material removal (polishing), the method performs punch-shaping to planarize the welded portions in a way that adds or redistributes material rather than removing it. This inverted approach maintains thickness while achieving surface smoothness.

Inventive Principle:
Principle #13The other way round (Inversion)

2Manufacturing precision

If the welded portions are planarized by polishing, then the surface smoothness is improved, but the work time and cost increase

Engineering Contradiction:
Improvesurface smoothnessVSAvoidwork time
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The invention merges the planarization function into the existing punch-shaping process. By integrating the planarization of welded portions into the punch-shaping operation that is already performed for other manufacturing purposes, the method eliminates the need for a separate polishing step. This combination achieves surface smoothness without increasing overall work time or cost.

Inventive Principle:
Principle #5Merging (Combining)

3Shape

If the metal frame is punched and bent after welding, then the frame shape is formed, but surface sinking occurs at the welded portions

Engineering Contradiction:
Improveframe shapeVSAvoidsurface flatness at welded portion
Core Design Contradiction:
ShapeVSManufacturing precision

Solution Approach 1:

The invention applies preliminary action by performing punch-shaping to planarize the welded portions before the punch-bending process. This advance planarization ensures that when the frame is subsequently punched and bent, the welded portions maintain their planar surface without sinking, as the material has been pre-conditioned to resist deformation during bending.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method effectively planarizes the welded portions without material removal, reducing work time and cost compared to traditional polishing, while maintaining the structural integrity of the metal frame.

Implementation Method 1

the welded portion between the frame members is planarized by punch-shaping

Methodology Applied
Scientific EffectPlastic deformation: Plasticity

Implementation Method 2

the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member

Methodology Applied
Scientific EffectWelding: Welding

Data Source

PatentUS9329420B2Electronic device and manufacturing method thereof
Publication Date: 2016.05.03 WISTRON CORP
  • US9329420B2 patent drawing
  • US9329420B2 patent drawing
  • US9329420B2 patent drawing

AI summary

A method for manufacturing an electronic device is provided, including the following steps. First, an outer frame is provided, wherein the outer frame comprises the first frame member and the second frame member. Next, the first frame member is connected to the second frame member by welding to form a connected structure, wherein a welded portion is formed between the first frame member and the second frame member. Then, a punch pin and a punch base are provided. Next, the connected structure is placed on the punch base. Finally, the connected structure is punched by the punch pin.