Welded Conductive I/O Connector With Airflow Cooling Channels
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Solution Overview
Problem
High heat generation in electronic devices with stacked transceivers, such as QSFP and OSFP, leads to temperature increases that can cause operational errors and reduce component lifetime, necessitating improved heat dissipation and signal integrity in high-density I/O connectors.
Innovation Solution
The design of I/O connectors with a web-like housing and conductive elements, featuring openings and airflow channels, along with conductive members welded to ground conductors, enhances thermal and electrical performance, allowing efficient airflow and signal integrity for high-speed transceivers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If transceivers are stacked in close proximity to increase I/O density, then productivity is improved, but temperature increases due to heat generation
Solution Approach 1:
The connector housing is segmented with multiple openings and airflow channels that divide the internal space, allowing heat to be dissipated through multiple pathways rather than accumulating in a single enclosed space. This segmentation enables efficient thermal management while maintaining high I/O density through stacked transceiver configuration.
2Temperature
If metal cage and heat sinks are added to dissipate heat, then temperature is reduced, but device complexity increases
Solution Approach 1:
The connector housing integrates multiple functions into a single component: it provides mechanical support for stacked transceivers, creates airflow channels for cooling, and incorporates openings that allow heat dissipation without requiring separate metal cages or external heat sinks. This merging reduces overall device complexity while achieving effective thermal management.
3Reliability
If conductive members are welded to ground conductors to improve signal integrity, then reliability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent replaces traditional mechanical connections (such as soldering or crimping) with welding to join conductive members to ground conductors. This substitution provides superior electrical contact and signal integrity through metallurgical bonding, though it requires specialized welding equipment and processes. The welding approach ensures low-impedance ground paths that maintain signal integrity at high data rates.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective heat dissipation and maintains signal integrity, enabling operation at data rates above 110 Gbps with minimal temperature rise, even in stacked configurations, thus improving the reliability and performance of high-performance electronic devices.
Implementation Method 1
conductive members welded to ground conductors, enhances thermal and electrical performance
Implementation Method 2
openings and airflow channels, allowing efficient airflow
Data Source
AI summary
A stacked I/O connector for use with a high speed, high density transceiver that generates a large amount of heat. The connector may be formed with a web-like housing into which leadframe assemblies are inserted. The web-like housing may have openings in the front, back, top and/or sides, enabling airflow through the connector with little resistance. Sidewall openings may open into a channel between the housing and a wall of cage, enabling air flowing to cool transceivers inserted into the cage to pass through the connector assembly with low resistance and high cooling efficiency. A cage for the connector may have openings selectively positioned such that air flowing through the cage to cool transceivers mated to the I/O connector may pass through the connector with low resistance, enhancing cooling efficiency. Such a connector may be used with OSFP transceivers to meet signal integrity and thermal requirements at 112 GBps and beyond.