LED Lighting Apparatus With Welded Heat Dissipating Plate
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Solution Overview
Problem
High-luminance LED lighting apparatuses face reduced lifespan due to thermal energy generated when in operation, as existing methods for heat dissipation, such as thermal pads and coupling members, have inconsistent heat transfer characteristics and are limited by their assembly states.
Innovation Solution
A LED lighting apparatus design where the printed circuit board and heat dissipating plate are welded and bonded, utilizing a heat transfer pad and intermediate pads with solder pattern layers to create a direct thermal path, and optionally incorporating an intermediate plate to manage heat distribution and ensure stable bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If thermal pad and coupling members are used for heat dissipation, then heat transfer area is increased, but heat transfer coefficient varies by manufacturer and assembly state
Solution Approach 1:
The patent removes the thermal pad from the heat dissipation system and replaces it with a direct welding connection between the LED module and heat dissipation plate. This extraction of the thermal pad eliminates the variability in heat transfer characteristics caused by different manufacturers and assembly states, while maintaining effective thermal contact through the welded joint.
Solution Approach 2:
The patent merges the LED module and heat dissipation plate into a single integrated structure through welding. This combining eliminates the interface between separate components (LED module-thermal pad-heat dissipation plate) and creates a direct thermal path, ensuring consistent and reliable heat transfer regardless of assembly variations.
2Productivity
If pressing is performed using coupling members to increase thermal contact area, then heat dissipation efficiency is improved, but assembly complexity increases
Solution Approach 1:
The patent combines the functions of mechanical attachment and thermal conduction into a single welding operation. The welding joint simultaneously provides structural support and optimal thermal contact, eliminating the need for separate coupling members and pressing mechanisms, thereby simplifying the assembly structure while maintaining high heat dissipation efficiency.
Solution Approach 2:
The patent replaces the mechanical pressing system (coupling members applying force) with a welding process that creates a permanent metallurgical bond. This substitution eliminates the need for complex mechanical assembly and disassembly operations, reducing assembly complexity while ensuring consistent thermal contact.
3Illumination intensity
If multiple high-luminance LEDs are mounted on small surface area, then illumination intensity is increased, but temperature of LEDs increases
Solution Approach 1:
The patent segments the heat dissipation function from the light emission function by using a dedicated heat dissipation plate that is thermally coupled to the LED module through welding. This segmentation allows the LEDs to operate at high intensity while the heat is efficiently conducted away through the welded thermal path, preventing temperature buildup.
Solution Approach 2:
The patent introduces a heat dissipation plate as an intermediary component between the LED module and the environment. This mediator efficiently conducts heat away from the high-power LEDs through a direct welded connection, enabling high illumination intensity while maintaining safe operating temperatures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables rapid heat dissipation from LEDs, maintaining low temperatures and extending the lifespan of the lighting apparatus while improving assembly stability and heat transfer efficiency without additional components.
Implementation Method 1
The printed circuit board and the heat dissipating plate may be welded and bonded to each other
Implementation Method 2
The single LED may include a heat transfer pad provided on a bottom surface of the single LED
Implementation Method 3
The heat transfer pad and the first intermediate pad may be welded to each other through a first solder pattern layer
Data Source
AI summary
Provided is a Light Emitting Diode (LED) lighting apparatus, and more particularly, an LED lighting apparatus that effectively dissipates heat generated from a single LED. The LED lighting apparatus according to an exemplary embodiment includes a single LED which emits light, a printed circuit board which includes a base plate having a first surface and a second surface opposing each other, and in which the single LED is mounted on the first surface, and a heat dissipating plate which is provided on the second surface to dissipate the heat generated from the single LED. And the printed circuit board and the heat dissipating plate may be welded and bonded to each other.