Welded Shunt Sensor Structure for Heat Dissipation and Fewer Parts

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Solution Overview

Problem

Conventional shunt sensors face issues with insufficient heat dissipation and increased part count due to screw fixation, especially when handling large currents, and require complex assembly processes.

Innovation Solution

The shunt sensor employs a substrate fixed to a shunt resistor using welding instead of screws, with a gap formed between the substrate and base members to enhance heat dissipation and reduces part count by eliminating screws, while one fixing terminal is connected to a ground pattern for anti-noise measures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If the substrate is screw-fixed to the shunt resistor, then the substrate is securely mounted, but heat dissipation becomes insufficient and the number of parts increases

Engineering Contradiction:
Improvemounting securityVSAvoidheat dissipation
Core Design Contradiction:
StrengthVSTemperature

Solution Approach 1:

The patent removes the screw fixation components and extracts the heat dissipation function by creating a gap structure between the substrate and shunt resistor body. This allows heat to escape through the gap without requiring mechanical fasteners, simultaneously improving heat dissipation while reducing part count.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent combines the mounting function and heat dissipation function into a single integrated structure. The substrate is directly mounted on the shunt resistor body with a built-in gap that serves both as a thermal pathway and as the mounting interface, eliminating the need for separate screws and heat sinks.

Inventive Principle:
Principle #5Merging (Combining)

2Strength

If the substrate is screw-fixed to the shunt resistor, then the substrate is securely mounted, but the number of parts increases and assembly complexity increases

Engineering Contradiction:
Improvemounting securityVSAvoidnumber of parts
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent merges the mounting function and heat dissipation function into a single integrated structure. The substrate is directly mounted on the shunt resistor body with a built-in gap that serves both as a thermal pathway and as the mounting interface, eliminating the need for separate screws and heat sinks.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent removes the screw fixation components and extracts the heat dissipation function by creating a gap structure between the substrate and shunt resistor body. This allows heat to escape through the gap without requiring mechanical fasteners, simultaneously improving heat dissipation while reducing part count.

Inventive Principle:
Principle #2Taking out (Extraction)

3Strength

If the substrate is screw-fixed to the shunt resistor, then the substrate is securely mounted, but assembly time increases for high-volume production

Engineering Contradiction:
Improvemounting securityVSAvoidassembly speed
Core Design Contradiction:
StrengthVSProductivity

Solution Approach 1:

The patent removes the screw fixation components and extracts the heat dissipation function by creating a gap structure between the substrate and shunt resistor body. This allows heat to escape through the gap without requiring mechanical fasteners, simultaneously improving heat dissipation while reducing part count.

Inventive Principle:
Principle #2Taking out (Extraction)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration improves heat dissipation and reduces part count, allowing accurate measurement of large currents with reduced noise interference.

Implementation Method 1

The substrate (3, 3A) is fixed only by welding (32)

Methodology Applied
Scientific EffectWelding: Welding

Implementation Method 2

heat generated in the resistor (20) and its periphery is dissipated by the gap (S1)

Methodology Applied
Scientific EffectHeat dissipation: Convection

Data Source

PatentEP3879276B1Shunt sensor
Publication Date: 2026.04.22 SUNCALL CORP
  • EP3879276B1 patent drawingFigure 1
  • EP3879276B1 patent drawingFigure 2
  • EP3879276B1 patent drawingFigure 3

AI summary

[Problem] To provide a shunt sensor that makes it possible to enhance heat dissipation and reduce the number of components. [Solution] This invention comprises: a resistor 20; a pair of base members 21 that sandwich the resistor 20 and are formed integrally with the resistor 20; measurement terminals 22 fixed to the tops of the base members 21; and a substrate 3 that the measurement terminals 22 are inserted into and is disposed and fixed at a position opposing the base members 21. Each of the measurement terminals 2 comprises a shaft part 22a and a flange part 22b that protrudes outward in the circumferential direction of the shaft part 22a so as to protrude from the top of the corresponding base member 21 when the measurement terminal 22 is fixed to the base member 21. The shaft parts 22a are inserted into the substrate 3 and fixed to the substrate 3 by welding 32. The substrate 3 is disposed above the flange parts 22b.