Wet Bench In-Situ Pre-Treatment for Wafer Cross-Contamination

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Solution Overview

Problem

Cross contamination during wet bench processing of semiconductor wafers leads to defects, necessitating a solution to improve yield and reduce contamination.

Innovation Solution

An in-situ pre-treatment process is performed in an ONB tank prior to wet bench operations, including pre-cleaning and/or pre-heating to remove organic contamination and stabilize wafer temperature, using solutions like IPA or SC1, and high-temperature deionized water to prepare wafers before immersion in CHB tanks.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If batches of wafers are processed simultaneously in a tank during wet bench process, then productivity is improved, but cross contamination occurs causing defects

Engineering Contradiction:
Improvebatch processing capabilityVSAvoidcross contamination
Core Design Contradiction:
ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by performing pre-treatment operations (pre-cleaning and pre-heating) on wafers before they enter the main wet bench processing tanks. This prepares the wafers in advance to resist cross-contamination during batch processing, allowing larger batch sizes while maintaining cleanliness. The pre-treatment modifies the wafer surface state beforehand, creating a protective condition that prevents harmful cross-contamination effects during subsequent batch processing.

Inventive Principle:
Principle #10Preliminary action

2Device complexity

If conventional wet bench processing is used without pre-treatment, then device complexity is reduced, but manufacturing precision deteriorates due to cross contamination

Engineering Contradiction:
Improveprocessing stepsVSAvoidwafer cleanliness
Core Design Contradiction:
Device complexityVSManufacturing precision

Solution Approach 1:

The patent applies segmentation by dividing the wet bench processing into distinct segments: a pre-treatment segment (pre-cleaning and pre-heating in separate tanks) followed by the main processing segment. This segmentation isolates the critical cleanliness-preparation steps from the main batch processing, allowing each segment to be optimized independently. The pre-treatment segment specifically addresses manufacturing precision by removing contaminants before wafers enter the main processing tanks, while the main segment maintains productivity through efficient batch processing.

Inventive Principle:
Principle #1Segmentation

3Use of energy by moving object

If wafer temperature is not stabilized before processing, then energy consumption is reduced, but etch rate stability deteriorates

Engineering Contradiction:
Improveenergy consumptionVSAvoidetch rate stability
Core Design Contradiction:
Use of energy by moving objectVSStability of the object's composition

Solution Approach 1:

The patent applies preliminary action by implementing a pre-heating step before the main wet bench processing. This pre-heating stabilizes the wafer temperature in advance, ensuring that when wafers enter the etching tanks, their temperature is already controlled and uniform. This preliminary temperature stabilization prevents etch rate variations during processing, maintaining manufacturing precision without requiring excessive energy during the main processing phase, as the thermal conditioning is already complete.

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Reduces cross-contamination and defects, enhances yield by allowing larger batch sizes and stabilizes etch rates through improved temperature control.

Implementation Method 1

pre-cleaning and/or pre-heating to remove organic contamination

Methodology Applied
Scientific EffectChemical cleaning: Oxidation

Implementation Method 2

pre-cleaning and/or pre-heating to remove organic contamination and stabilize wafer temperature, using solutions like IPA or SC1, and high-temperature deionized water

Methodology Applied
Scientific EffectThermal heating: Heating

Data Source

PatentUS20250385096A1Wet bench process with in-situ pre-treatment operation
Publication Date: 2025.12.18 TAIWAN SEMICONDUCTOR MANUFACTURING CO LTD
  • US20250385096A1 patent drawing
  • US20250385096A1 patent drawing
  • US20250385096A1 patent drawing

AI summary

Embodiments of the present disclosure relates to a wet bench processing including an in-situ pre-treatment prior to performing the first set of wet bench operations. The pre-treatment may include a pre-clean operation and/or a pre-heat operation. The pre-treatment may be performed in one of the existing ONB tanks without requiring adding new tanks to an existing wet bench tool. The pre-clean operation removes particles from a batch of wafers to avoid or reduce cross-contamination and defect issues, thus improving the yield rate of the wet bench process. The pre-heat operation provides better control and stabilize the temperature in the CHB tank to stabilize the process, such as to stabilize an etch rate.