Wet Alignment of Micro-Semiconductor Chips Using Liquid Absorption
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Solution Overview
Problem
The yield rate of the pick and place method for transferring micro-LEDs onto substrates decreases as the size of the micro-LEDs decreases and the size of the display increases, making it challenging to efficiently align and transfer micro-semiconductor chips in manufacturing processes.
Innovation Solution
A micro-semiconductor chip wet alignment apparatus is developed, which includes a semiconductor chip wet supply module that supplies micro-semiconductor chips and a liquid onto a transfer substrate, allowing the chips to move with the liquid. The apparatus also features a chip alignment module with an absorber that moves along the substrate's surface, absorbing the liquid and aligning the chips into grooves on the substrate.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If the pick and place method is used to transfer micro-LEDs onto substrates, then the transfer process can be performed, but the yield rate decreases as the size of the micro-LEDs decreases and the size of the display increases
Solution Approach 1:
The patent introduces a liquid medium as an intermediary between the micro-LEDs and the substrate. The micro-LEDs are first placed on the liquid, which acts as a temporary carrier, and then the liquid is removed to transfer the aligned micro-LEDs to the substrate. This intermediary approach enables precise alignment without the limitations of direct pick-and-place methods for small components.
Solution Approach 2:
The patent utilizes hydraulic principles by employing a liquid medium to carry and position the micro-LEDs. The liquid flow and level control enable precise positioning of the micro-LEDs on the substrate, replacing mechanical pick-and-place mechanisms with fluid-based positioning for improved accuracy and yield rate.
2Manufacturing precision
If the size of micro-LEDs is decreased to improve display quality, then the display resolution increases, but the alignment difficulty and yield rate decrease
Solution Approach 1:
The liquid medium serves as an intermediary that enables handling and alignment of smaller micro-LEDs without requiring direct mechanical manipulation. This allows the manufacturing process to accommodate reduced chip sizes while maintaining high yield rates through fluid-based positioning rather than mechanical grasping.
Solution Approach 2:
The patent changes the physical state and properties of the working medium from solid mechanical grippers to liquid carrier. This parameter change enables the system to handle smaller micro-LEDs effectively, as the liquid can adapt to and support smaller components without the precision requirements that limit mechanical pick-and-place methods.
3Area of stationary object
If the size of display is increased to meet market demand, then the coverage area increases, but the alignment precision and yield rate decrease
Solution Approach 1:
The liquid medium acts as a scalable intermediary that can accommodate large display areas while maintaining alignment precision. The liquid carrier allows micro-LEDs to be positioned accurately across extended substrates, overcoming the limitations of mechanical alignment systems when scaling to larger display dimensions.
Solution Approach 2:
The patent transitions from two-dimensional mechanical alignment to three-dimensional liquid-based positioning. By utilizing the liquid medium's depth and flow characteristics, the system achieves precise alignment across large areas through vertical and horizontal fluid control, enabling scalable manufacturing for large displays.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The apparatus effectively increases the yield rate of micro-LED transfer by ensuring precise alignment and transfer of micro-semiconductor chips, even as chip sizes decrease and display sizes increase, thereby improving manufacturing efficiency and reducing costs.
Implementation Method 1
a chip alignment module comprising an absorber configured to be moved along a surface of the transfer substrate and absorb the liquid so that the plurality of micro-semiconductor chips are aligned in a plurality of grooves of the transfer substrate
Data Source
AI summary
A micro-semiconductor chip wet alignment apparatus is provided. The micro-semiconductor chip wet alignment apparatus includes a semiconductor chip wet supply module configured to supply the plurality of micro-semiconductor chips and a liquid onto the transfer substrate so that the plurality of micro-semiconductor chips are flowable on the transfer substrate; and a chip alignment module including an absorber capable of relative movement along a surface of the transfer substrate and configured to absorb the liquid so that the plurality of micro-semiconductor chips are aligned in the plurality of grooves.