Wet Chip Transfer Substrate Alignment for Micro LED Throughput
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Solution Overview
Problem
The pick-and-place method for transferring micro LEDs is inefficient as the size of micro LEDs decreases and display size increases, leading to reduced productivity.
Innovation Solution
A chip wet transfer apparatus using a wet method with a first and second chip supply module to align micro-semiconductor chips in grooves of a transfer substrate, accompanied by an inspection module and controller for optimizing chip placement.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If pick-and-place method is used for transferring micro LEDs, then transfer capability is maintained, but productivity decreases as micro LED size decreases and display size increases
Solution Approach 1:
The transfer substrate is divided into multiple grooves that can simultaneously accommodate multiple micro-LED chips. The suspension system delivers chips to multiple grooves at once, segmenting the transfer process into parallel operations rather than sequential pick-and-place actions, thereby dramatically increasing productivity.
Solution Approach 2:
The invention uses a liquid suspension medium (hydraulic approach) to transport micro-LED chips to the transfer substrate. The suspension flows through the system and deposits chips into multiple grooves simultaneously, replacing the mechanical pick-and-place method with a fluid-based transport system that enables parallel processing.
2Quantity of substance
If first suspension with large volume is supplied to fill all grooves, then chip coverage is maximized, but liquid consumption and processing complexity increase
Solution Approach 1:
The system first supplies a large-volume suspension to potentially fill all grooves (excessive action), then uses a second, smaller-volume suspension to selectively refill only the empty grooves. This two-stage approach ensures complete coverage while optimizing liquid consumption and enabling inspection-based control.
Solution Approach 2:
An inspection module detects which grooves are empty after the first suspension is supplied. The controller uses this feedback information to determine which grooves need refilling with the second suspension, enabling precise control over chip placement and optimizing the overall process.
3Loss of substance
If second suspension with smaller volume is supplied to refill empty grooves, then liquid consumption is optimized, but requires inspection and control systems
Solution Approach 1:
An inspection module detects which grooves are empty after the first suspension is supplied. The controller uses this feedback information to determine which grooves need refilling with the second suspension, enabling precise control over chip placement and optimizing the overall process.
Solution Approach 2:
The system first supplies a large-volume suspension to potentially fill all grooves (excessive action), then uses a second, smaller-volume suspension to selectively refill only the empty grooves. This two-stage approach ensures complete coverage while optimizing liquid consumption and enabling inspection-based control.
Data Source
AI summary
A chip wet transfer apparatus includes a first chip supply module configured to supply a large amount of micro-semiconductor chips to a transfer substrate, a first chip alignment module configured to align the large amount of micro-semiconductor chips in a plurality of grooves, a second chip supply module configured to supply a small amount of micro-semiconductor chips, and a second chip alignment module configured to align the small amount of micro-semiconductor chips.