Multi-Nozzle Wet Etching Control for Target Profile Distribution
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Solution Overview
Problem
Conventional semiconductor processing technologies face challenges in achieving complex etching amount distribution during wet etching in single-wafer cleaning, as the existing swing sequence methods are inefficient in controlling etching profiles and require manual optimization by engineers through trial and error.
Innovation Solution
An etching control system comprising a prediction device that calculates process parameters using a model relating etching amount distribution to nozzle operations, and an etching control device that updates and executes a process recipe to control nozzle discharge times, positions, and speeds, enabling precise control of etching profiles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional swing sequence methods are used for wet etching, then the etching process can be performed, but the etching amount distribution cannot be precisely controlled and requires manual optimization by engineers through trial and error
Solution Approach 1:
The patent applies parameter changes by using a prediction device that calculates optimal process parameters (discharge time, discharge position, moving speed) for multiple nozzles based on a model. This automated parameter optimization replaces manual trial-and-error methods, enabling precise control of etching amount distribution while improving the extent of automation in the etching process.
2Productivity
If manual optimization by engineers through trial and error is used, then the etching process can be adjusted, but the process efficiency is reduced and time-consuming
Solution Approach 1:
The patent implements self-service by using a prediction device with a built-in model that automatically calculates optimal process parameters without requiring manual intervention from engineers. The system performs self-optimization by inputting target etching amount distribution and automatically outputting the best discharge time, discharge position, and moving speed parameters, thereby improving productivity and eliminating time-consuming manual trial and error.
3Adaptability or versatility
If simple nozzle control is used, then the device operation is simple, but complex etching amount distributions cannot be achieved
Solution Approach 1:
The patent applies segmentation by dividing the etching process into multiple independent nozzles, each with controllable discharge time, discharge position, and moving speed. This segmentation allows complex etching amount distributions to be achieved by coordinating multiple nozzles, while the prediction device simplifies the control complexity by automatically calculating the optimal parameters for each nozzle based on the target distribution.
Data Source
AI summary
An etching control system includes a prediction device and an etching control device. The prediction device includes a calculator configured to calculate, by using a model indicating a relationship between distribution of an etching amount within a surface of a substrate and a process parameter, which is a parameter of controlling operations of multiple nozzles configured to etch the substrate, the process parameter corresponding to distribution of a designated etching amount. The etching control device includes an updating unit configured to update a process recipe, which is information including a discharge time, a discharge position, and a moving speed of each of the multiple nozzles, based on the process parameter; and an operation controller configured to control the operations of the multiple nozzles according to the process recipe updated by the updating unit.