Side-Opening Wet Processing Tank for Uniform Large-Substrate Treatment
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Solution Overview
Problem
Conventional wet processing apparatuses face challenges in uniformly processing large substrates for panel-level semiconductor packaging due to complex substrate transfer and non-uniform wet processing solution distribution, leading to inefficiencies and high maintenance costs.
Innovation Solution
A wet processing apparatus with a simple structure that allows direct substrate mounting on the tank body, featuring a fixing device with automated clamping mechanisms and a wet processing solution drive device using blades to ensure uniform solution distribution and prevent nozzle clogging, facilitating efficient and uniform treatment of large substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional substrate transfer mechanisms are used, then substrate can be processed, but substrate mounting time increases and production efficiency decreases
Solution Approach 1:
The substrate mounting plate is pre-positioned at the opening of the tank body, and the fixing device is pre-configured with clamping pieces ready to engage the substrate. This preliminary preparation eliminates the need for complex transfer mechanisms and reduces mounting time significantly.
Solution Approach 2:
The substrate mounting function is extracted from the complex transfer mechanism and integrated directly into the tank body structure. The mounting plate and fixing device are positioned at the opening, allowing direct substrate placement without intermediate transfer steps.
2Manufacturing precision
If complex substrate transfer mechanisms are used, then substrate can be positioned, but device complexity increases
Solution Approach 1:
The substrate mounting and positioning functions are merged into a single integrated system at the tank opening. The mounting plate combines support and positioning functions, while the fixing device integrates clamping and securing operations, eliminating the need for separate transfer mechanisms.
Solution Approach 2:
The mounting plate serves multiple functions: supporting the substrate, positioning it at the correct location, and providing a interface for the fixing device. The fixing device itself performs both clamping and positioning adjustments, reducing the need for specialized components.
3Manufacturing precision
If conventional wet processing solution distribution is used, then processing can be performed, but solution distribution uniformity decreases
Solution Approach 1:
The wet processing solution distribution is segmented into multiple spray nozzles arranged in arrays. These nozzles are distributed across different positions to ensure uniform coverage of the entire substrate surface, preventing localized concentration variations.
Solution Approach 2:
The spray nozzles act as intermediaries between the wet processing solution source and the substrate surface. They distribute the solution uniformly across the substrate, ensuring consistent processing conditions throughout the treatment area.
4Manufacturing precision
If spray nozzles are used for solution distribution, then processing can be performed, but nozzle clogging occurs increasing maintenance costs
Solution Approach 1:
The system parameters for solution distribution are optimized to prevent clogging. This includes adjusting spray pressure, nozzle geometry, and solution flow rates to maintain laminar flow conditions that reduce particle deposition and clogging risks.
Solution Approach 2:
The spray nozzles are designed as easily replaceable components with simple structures that can be quickly swapped out if clogging occurs. This minimizes maintenance downtime and costs, as the nozzles can be replaced without complex disassembly or specialized tools.
Data Source
AI summary
A wet processing apparatus and an operation method thereof are provided. The wet processing apparatus includes: a tank body including at least one side wall, the at least one side wall being provided with an opening extending from the inside to the outside of the tank body, and the tank body being configured to accommodate a wet processing solution; and a fixing device configured to fix the substrate at the opening of the side wall. The operation method of the wet processing apparatus includes: placing the substrate on an outer side of the side wall and at the position of the opening, and operating the fixing device to fix the substrate; and performing wet processing treatment on the substrate.