Wet-Tack Sintering Tilt Control to Prevent Bonding Voids
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Solution Overview
Problem
The challenge in wet-tack sintering is accurately maintaining the position of components during bonding to avoid air entrapment between the component and the sintering paste, leading to internal voids and poor product quality.
Innovation Solution
A method and apparatus using a movable support mechanism to tilt the component relative to the carrier, allowing gradual contact with the sintering paste to expel trapped air before sintering.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If the component is placed directly onto the sintering paste with the sintering surface fully contacting the paste, then the bonding area is maximized, but air is trapped between the component and the paste due to surface tension, leading to internal voids
Solution Approach 1:
The support mechanism is positioned beforehand to tilt the component at a predetermined angle before the sintering paste is applied. This preliminary positioning ensures that when the component contacts the paste, air can escape from the bonding interface without creating voids, while still achieving full contact area during the sintering process
Solution Approach 2:
The support mechanism is designed to be movable, allowing the component to be tilted at different angles during the bonding process. The system dynamically adjusts the component orientation to facilitate air escape during contact, then maintains proper alignment during sintering to ensure maximum bonding area
2Object-generated harmful factors
If the sintering surface is tilted relative to the carrier to facilitate air removal, then air entrapment is reduced, but the component positioning precision may be compromised
Solution Approach 1:
The support mechanism provides dynamic adjustment of the component angle, allowing the sintering surface to be tilted during the bonding phase for air removal, then returning to a horizontal position during the sintering phase to ensure precise positioning and uniform bonding across the entire surface
Solution Approach 2:
The support mechanism continuously maintains the component in the desired tilted position throughout the bonding process, ensuring uninterrupted air escape. The system then smoothly transitions to maintain horizontal positioning during sintering, ensuring continuous useful action without compromising either air removal or positioning precision
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the quality and electrical performance of the sintered product by preventing air entrapment and ensuring uniform contact with the sintering paste.
Implementation Method 1
sintering the component to the carrier when the remainder of the sintering surface of the component is resting on the sintering paste
Data Source
AI summary
Prior to sintering a component to a carrier, a portion of a sintering surface at or adjacent to a first side of the component is caused to contact a sintering paste applied on the carrier when a second side of the component that is opposite to the first side is supported by a support mechanism, such that the sintering surface of the component is tilted relative to the carrier. The support member is then moved to gradually reduce a distance between the second side of the component and the carrier so as to cause a remainder of the sintering surface of the component to contact the sintering paste. Therefore, air that is present between the component and the sintering paste may be removed before the component is sintered to the carrier.