Wettable Side Component Manufacturing for Inspectable Solder Joints
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Solution Overview
Problem
Existing processes for manufacturing wettable edge electronic components do not adequately address the need for reliable and visually inspectable connections in applications such as automotive and medical fields.
Innovation Solution
A method involving the deposition of a layer of insulating material in cavities of a substrate, followed by the deposition of a conductive material in trenches formed within these cavities, to create wettable sides on electronic components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If connection metallizations are extended to the sides of components to enable visual inspection of solder connections, then reliability of electrical connections is improved, but manufacturing complexity increases due to additional deposition steps
Solution Approach 1:
The patent divides the side wall structure into two distinct functional layers: an insulating material layer deposited first, followed by a conductive material layer deposited second. This segmentation allows each layer to perform its specific function - the insulating layer provides electrical isolation while the conductive layer enables soldering and visual inspection, thereby achieving reliable electrical connections without compromising manufacturing feasibility
Solution Approach 2:
The patent applies different material properties to different regions of the component side walls. The insulating material is applied to the entire side wall surface first, then the conductive material is selectively deposited only in specific areas where solder connections are needed. This local differentiation enables visual inspection and reliable electrical connections at critical points while maintaining manufacturing control
2Reliability
If insulating material is deposited in cavities and conductive material is deposited on top to form wettable sides, then visual inspection of connections is enabled, but manufacturing time increases due to sequential deposition steps
Solution Approach 1:
The patent performs the insulating material deposition as a preliminary action before depositing the conductive material. By establishing the insulating layer first in the cavities and on the side walls, the subsequent conductive material deposition is facilitated and can be performed more efficiently, as the substrate preparation is already complete. This sequential preliminary action reduces overall manufacturing cycle time compared to alternative approaches that might require rework or additional preparation steps
Solution Approach 2:
The patent maintains continuous useful action by depositing the conductive material directly onto the freshly deposited insulating material without intermediate processing steps. This continuous deposition process eliminates idle time between steps and ensures that the manufacturing cycle proceeds efficiently, achieving visual inspection capability without excessive time loss
3Reliability
If connection pads are covered with insulating material and then conductive material is deposited, then electrical insulation is improved, but accessibility of metal pads is reduced
Solution Approach 1:
The patent applies insulating material selectively - covering the connection pads to provide electrical insulation where needed, while leaving other areas of the side walls exposed or applying conductive material to create accessible wettable surfaces. This localized application of insulating properties ensures electrical isolation of pads while maintaining accessibility of metal surfaces for soldering and inspection in other regions
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the production of electronic components with reliable and visually inspectable connections, ensuring correct assembly and reliable electrical connections in applications where connections are not visible.
Implementation Method 1
a layer of insulating material is deposited in the cavities
Implementation Method 2
a layer of conductive material is deposited on the layer of insulating material
Data Source
Figure 1~2B
Figure 2C~2F
Figure 2G~3B
AI summary
The present description relates to a method for manufacturing electronic components with wettable sides from a substrate (301) in which chips are formed, the chips being separated by cavities, the method comprising a first step during which a layer of insulating material (121) is deposited then a second step during which a layer of conductive material (122) is deposited on the layer of insulating material (121) in order to form wettable sides.