Data Center Cooling With Wetted Surfaces for Rack Heat Removal

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Solution Overview

Problem

Conventional air cooling systems in data centers are inefficient in removing waste heat, requiring large amounts of energy and occupying valuable rack space, while existing thermal regulation methods fail to effectively manage the significant heat generated by computing equipment.

Innovation Solution

A liquid-based cooling system that uses a wetted surface to transfer heat from ambient air to a liquid, creating cold air that is directed into cold air aisles to cool computing devices, without modifying existing rack-mounted equipment and without occupying additional rack space.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If conventional air cooling systems are used to remove waste heat from data centers, then heat removal is achieved, but large amounts of energy are consumed and rack space is occupied

Engineering Contradiction:
Improveenergy consumptionVSAvoidheat removal efficiency
Core Design Contradiction:
Loss of energyVSProductivity

Solution Approach 1:

The patent applies hydraulic cooling by circulating liquid through tubes mounted on rack panels. The liquid absorbs heat from computing devices through thermal conduction from the tubes, then transports the heat to a remote cooling system. This hydraulic approach replaces inefficient air cooling, significantly reducing energy consumption while maintaining effective heat removal capability.

Inventive Principle:
Principle #29Pneumatics and hydraulics

Solution Approach 2:

The patent transitions from three-dimensional air cooling (requiring airflow through rack spaces) to a two-dimensional liquid cooling system where tubes are mounted on panel surfaces. This dimensional change allows heat removal without occupying rack volume, as the cooling infrastructure is integrated into the rack panel structure rather than requiring spatial airflow paths.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

2Productivity

If conventional air cooling systems are used, then heat is removed from racks, but valuable rack space is occupied by cooling equipment

Engineering Contradiction:
Improveheat removal efficiencyVSAvoidrack space
Core Design Contradiction:
ProductivityVSVolume of moving object

Solution Approach 1:

The rack panels serve multiple functions: they provide structural support for computing devices and simultaneously serve as mounting surfaces for cooling tubes. This multi-functionality integrates the cooling infrastructure into existing rack structures, eliminating the need for separate cooling equipment that would occupy additional rack space.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The cooling system transitions from occupying three-dimensional rack space to utilizing two-dimensional panel surfaces. Tubes are mounted on the external surfaces of rack panels, converting the cooling infrastructure from a volume-consuming system to a surface-based system that does not interfere with rack-mounted equipment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

3Loss of energy

If rack space is occupied by cooling equipment, then heat removal capacity is increased, but available space for computing devices is reduced

Engineering Contradiction:
Improvecooling efficiencyVSAvoidavailable rack area
Core Design Contradiction:
Loss of energyVSArea of stationary object

Solution Approach 1:

The rack panels perform dual functions as both structural supports for computing devices and as mounting substrates for cooling tubes. This eliminates the need for dedicated cooling equipment that would compete for rack space, as the cooling function is integrated into the existing structural panels.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The rack panels act as intermediaries between the computing devices and the cooling system. Rather than directly mounting cooling equipment on devices or occupying device spaces, the panels serve as intermediary mounting surfaces that facilitate heat transfer without interfering with device placement or rack utilization.

Inventive Principle:
Principle #24Intermediary (Mediator)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution efficiently removes heat from data center racks, reducing energy consumption and optimizing space usage by generating cold air that effectively cools computing devices, thereby improving the thermal management of data centers.

Implementation Method 1

a wetted surface over which ambient air can travel so as to transfer heat from the ambient air to the liquid

Methodology Applied
Scientific EffectHeat transfer: Conduction (thermal)

Implementation Method 2

The liquid distribution system can include a plurality of open conduits that are substantially parallel to one another and that extend along a direction substantially parallel to the direction of airflow from the first end to the second end. The plurality of open conduits can be configured to receive the liquid so as to wet a portion of an outer surface of the frame

Methodology Applied
Scientific EffectEvaporative cooling: Evaporative Cooler

Data Source

PatentUS10070561B1Cooling system for data center
Publication Date: 2018.09.04 AMAZON TECH INC
  • US10070561B1 patent drawing
  • US10070561B1 patent drawing
  • US10070561B1 patent drawing

AI summary

A data center can include at least one computing room, and at least one rack system disposed in the computing room. The rack system includes a rack housing and a plurality of computing devices mounted to the rack housing. The data center can further include a cooling system that includes at least one surface that is wetted with a liquid, and delivers source air across the at least one surface such that heat is transferred from the source air to the liquid so as to produce cold air. The cold air then flows into a cold air aisle and is received in the computing devices so as to cool the computing devices.