Low Viscosity Wetting Agent for Semiconductor Polishing
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Solution Overview
Problem
Conventional polishing compositions for semiconductor substrates often result in nano-order defects due to insoluble matters in water-soluble polymer compounds, which are difficult to filter out without compromising wettability and surface smoothness.
Innovation Solution
A wetting agent comprising a water-soluble polymer compound with a viscosity of less than 10 mPa·s at 25°C, combined with colloidal silica and an alkaline compound, is used to improve substrate wettability and reduce microdefects by adjusting the polymer's molecular weight and filtration properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional polishing compositions with water-soluble polymer compounds are used, then wettability on semiconductor substrate surface is improved, but nano-order microdefects are formed due to insoluble matters in the polymer
Solution Approach 1:
The patent changes the viscosity parameter of the water-soluble polymer compound to less than 10 mPa·s at 25°C, which allows the polymer solution to be easily filtered while maintaining adequate wettability. This parameter optimization resolves the contradiction by enabling removal of insoluble matters through filtration without sacrificing the wetting function.
Solution Approach 2:
The patent extracts and removes insoluble matters from the water-soluble polymer compound through filtration before use in polishing. By separating the harmful insoluble components from the beneficial water-soluble polymer, the patent eliminates the source of microdefects while preserving the wettability-enhancing properties of the polymer.
2Manufacturing precision
If filtration is applied to remove insoluble matters from polymer compounds, then microdefects are reduced, but wettability may be compromised due to removal of polymer compounds
Solution Approach 1:
By optimizing the viscosity parameter to less than 10 mPa·s, the patent ensures that the polymer compound passes through filtration easily while retaining sufficient concentration to provide adequate wettability. This parameter control allows filtration to remove insoluble matters without excessively removing the beneficial polymer compound.
3Manufacturing precision
If polymer compound molecular weight is reduced to improve filtration, then insoluble matters are removed more effectively, but wettability may be insufficient
Solution Approach 1:
The patent optimizes the viscosity parameter (which correlates with molecular weight) to less than 10 mPa·s, finding the optimal balance point where the polymer compound is small enough to filter effectively but large enough to maintain adequate wettability. This precise parameter control resolves the contradiction between filtration efficiency and wettability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively improves hydrophilic properties and reduces microdefects on semiconductor substrates, achieving a smoother surface finish while maintaining sufficient wettability and preventing particle deposition.
Implementation Method 1
the wettability on the semiconductor substrate surface can be improved
Implementation Method 2
polishing a surface of the semiconductor substrate with the polishing composition
Data Source
AI summary
To provide a wetting agent for semiconductors and a polishing composition whereby the wettability of a semiconductor substrate surface can be improved, and microdefects such as particle attachments can be remarkably reduced.A wetting agent for semiconductors, comprising a water soluble polymer compound having a low viscosity and water, and a polishing composition. A 0.3 wt % aqueous solution of the water soluble polymer compound has a viscosity of less than 10 mPa·s at 25° C.