Compact Wick Heat-Dissipating Structure for Electronic Devices
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Solution Overview
Problem
In electronic devices, the reduction of heat-dissipating structure size to accommodate smaller form factors is hindered by increased internal pressure in the wick due to smaller opening sizes, which obstructs the flow of working fluids with high density and viscosity.
Innovation Solution
A heat-dissipating structure design where the size of the opening in the wick is determined based on the internal pressure and flow resistance of the working fluid, allowing for smooth fluid flow while maintaining a compact size, featuring a case with intersecting wires forming passages and channels that adjust fluid state changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of the opening in the wick is reduced to reduce the overall size of the heat-dissipating structure, then the compactness and portability are improved, but the internal pressure of the wick increases which obstructs the flow of working fluid
Solution Approach 1:
The patent applies parameter changes by carefully selecting and optimizing the opening size in the wick to balance two competing requirements: minimizing the overall structure volume while maintaining sufficient fluid flow. The opening size is specifically designed to be small enough for compactness but large enough to prevent excessive internal pressure that would obstruct working fluid flow. This parameter optimization resolves the contradiction between compactness and reliable fluid circulation.
2Volume of moving object
If the size of multiple wires in the wick is reduced to minimize the wick size, then the compactness is improved, but the opening size between wires decreases which increases internal pressure and hinders fluid flow
Solution Approach 1:
The patent employs parameter changes by optimizing the wire dimensions and spacing in the wick structure. The wire sizes and inter-wire opening dimensions are specifically selected to achieve the desired balance between compact wick volume and adequate fluid flow pathways. This parameter optimization ensures that the wick remains compact while maintaining sufficient opening areas for working fluid circulation, thereby resolving the contradiction between size reduction and flow maintenance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient heat dissipation while minimizing the size of the heat-dissipating structure and electronic device, ensuring optimal fluid flow and thermal management.
Implementation Method 1
the internal pressure of the wick may be increased as the size of the opening is reduced. The increased internal pressure of the wick may act as an obstacle factor to the flow of the working fluid
Data Source
AI summary
Disclosed is a heat-dissipating structure comprising: a case including: a first body and a second body spaced apart from each other; a wick disposed in a space between the first body and the second body, the wick including a plurality of wires arranged in a first direction and in a second direction intersecting the first direction, and having a working fluid passage formed along at least one opening formed between the plurality of wires; and a channel formed between the first body and the wick and in which the working fluid is moved through the at least one opening according to a change in state of the working fluid.