Vapor Chamber Wick Layout for Compact Electronic Heat Dissipation
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Solution Overview
Problem
Miniaturized electronic devices generate heat during operation, necessitating effective heat dissipation structures to prevent overheating and maintain performance.
Innovation Solution
The electronic device incorporates a vapor chamber with a first plate, a second plate supported by a wick structure, featuring a first wick covering one surface and a second wick extending along a connected region, designed to receive and dissipate heat efficiently.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a vapor chamber with wick structure is used to dissipate heat, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The patent employs a wick structure with porous material between the first and second plates to enable capillary action for heat dissipation. The porous wick material allows efficient heat transfer through capillary forces while maintaining a relatively simple overall device structure, resolving the contradiction between heat dissipation efficiency and device complexity.
Solution Approach 2:
The vapor chamber utilizes phase transition of working fluid (liquid to vapor and back) to transfer heat from the electronic component through the wick structure. This phase change mechanism provides high heat dissipation efficiency without requiring complex active cooling systems, thus improving heat dissipation while controlling device complexity.
2Area of stationary object
If the first portion of the wick is made wider to cover the heat dissipation region, then heat dissipation coverage is improved, but manufacturing complexity increases
Solution Approach 1:
The wick structure is segmented into different portions with different widths - the first portion has a greater width to cover the heat dissipation region, while the second portion has a smaller width. This segmentation allows the wick to be manufactured in sections that can be assembled together, improving heat dissipation coverage while managing manufacturing complexity through modular construction.
Solution Approach 2:
The wick structure implements local quality by having different widths at different locations - a wider first portion where heat dissipation is needed and a narrower second portion. This localized variation in geometry optimizes heat dissipation coverage at the heat-generating area while simplifying the structure in non-critical areas, balancing manufacturing ease with performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The vapor chamber effectively disperses heat generated by electronic components, ensuring optimal device performance and preventing overheating.
Implementation Method 1
a vapor chamber configured to receive at least a portion of heat emitted from the electronic component
Implementation Method 2
a first plate, a second plate supporting the first plate, and a wick structure between the first plate and the second plate
Implementation Method 3
a wick structure between the first plate and the second plate
Implementation Method 4
a wick structure between the first plate and the second plate
Data Source
AI summary
An electronic device according to an embodiment may comprise: a first plate; a second plate which supports the first plate; and a vapor chamber which includes a wick structure between the first plate and the second plate. The first plate may comprise: a first region which includes a heat dissipation portion; and a second region which is connected to the first region. The wick structure may comprise: a first wick including a first portion which covers one surface of the first region and a second portion which extends along the second region from the first portion; and a second wick extending from the second plate to the second portion.