Wide-Coverage Light Package With Integrated Optics and Driver Layout
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Solution Overview
Problem
Conventional light emitting device packages with optical lenses increase component count, manufacturing costs, and optical inefficiencies, leading to thicker designs and complex circuitry, while separate driving components on PCBs complicate assembly and raise costs.
Innovation Solution
A multifocal light-emitting package with micro-LEDs arranged around a driving element on a substrate, integrating the lens function into a protective member, reducing components and enhancing productivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If an optical lens is added to refract or diffuse light, then the light irradiation area is widened, but the number of components and manufacturing processes increases, resulting in higher product costs and decreased productivity
Solution Approach 1:
The patent merges the optical lens function with the protective member (molding compound) by forming the protective member with specific optical surface curvature and refractive index properties. This integration eliminates the need for separate optical lens components while maintaining the light irradiation area expansion function.
Solution Approach 2:
The protective member is designed to serve multiple functions simultaneously: it provides structural protection, optical light diffusion/refraction, and optical path definition. This multi-functionality reduces the overall component count while achieving the desired light irradiation area.
2Area of stationary object
If an optical lens is added to refract or diffuse light, then the light irradiation area is widened, but optical losses due to diffusion and refraction at the interface cause a significant decrease in optical efficiency
Solution Approach 1:
The patent optimizes optical efficiency by carefully selecting and controlling the refractive index of the protective member material and designing specific optical surface geometries. These parameter optimizations minimize optical losses at interfaces while achieving the required light diffusion and irradiation area expansion.
3Area of stationary object
If the focal length is increased to cover a broader area, then the light irradiation area is widened, but the required optical distance increases, resulting in a thicker backlight unit or a greater number of light emitting device packages needed
Solution Approach 1:
The patent transitions from a single-focal-point configuration to a multi-focal-point arrangement by positioning multiple light emitting devices at different locations around the periphery of the substrate. This spatial redistribution in multiple dimensions achieves broader light coverage without increasing the optical path length or unit thickness.
4Ease of operation
If separate driving components are mounted on the PCB, then the light emitting device can be driven, but the wiring layer becomes extremely complex, necessitating a multilayer wiring structure and increasing circuit complexity
Solution Approach 1:
The patent integrates the driving components directly into the light emitting device package structure, combining the light emitting element and driving circuitry into a single integrated unit. This integration eliminates the need for separate driving components on the PCB and simplifies the wiring structure.
5Ease of manufacture
If light emitting devices and driving components are mounted on the same planar PCB, then assembly is simplified, but the overall package and circuit structure becomes larger, leading to increased raw material costs
Solution Approach 1:
The patent embeds the driving components within the three-dimensional space of the light emitting device package, nesting the circuitry inside or around the light emitting element. This nested arrangement achieves compact packaging while maintaining manufacturing feasibility through standardized assembly processes.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Achieves high luminous flux, wide emission angle, and reduced thickness with lower costs and improved efficiency by minimizing components and circuit complexity.
Implementation Method 1
at least one light emitting device mounted on a portion of the wiring layer
Implementation Method 2
an additional optical lens capable of refracting or diffusing the light along the optical path
Implementation Method 3
an additional optical lens capable of refracting or diffusing the light along the optical path
Data Source
AI summary
A wide-area light-emitting driving package, a backlight unit, and a display device are disclosed. The wide-area light-emitting driving package may include a substrate, a terminal layer formed on one surface of the substrate, a wiring layer formed on the opposite surface of the substrate and electrically connected to the terminal layer through through-electrodes, at least one light-emitting device mounted on a portion of the wiring layer and disposed at a peripheral region of the substrate, a driving element mounted on another portion of the wiring layer, disposed at a central region of the substrate, and configured to drive the light-emitting device, and a protective member covering and protecting the light-emitting device and the driving element.