Wide Interposer Stiffening Layer for Test Board Durability
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Solution Overview
Problem
Electronic testing systems, particularly those used for semiconductor power devices, face short usability lifetimes due to mechanical and high power electrical stresses, leading to frequent damage and replacement of test boards.
Innovation Solution
A wide test interposer with a stiffening layer attached to an interposer layer, comprising multiple test sites that can be fixed in position, using a polyimide material for the interposer layer and a glass-reinforced epoxy resin for the stiffening layer, connected via adhesive, to prevent crumpling and maintain site alignment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a test board uses a plunge to board (PTB) concept with a handler plunger mechanism through a test socket, then mechanical force is applied to secure the device, but the test board suffers mechanical damage and has a short usability lifetime
Solution Approach 1:
The test board is divided into a test socket module and a test board substrate. The test socket is mounted in a recess and isolated from direct mechanical contact with the plunger, separating the electrical testing function from the mechanical force path.
Solution Approach 2:
A recess structure acts as an intermediary between the plunger and the test socket. The plunger contacts the recess bottom rather than the test socket directly, preventing mechanical force from being transmitted to the test board footprint and protecting it from damage.
2Power
If high power electrical testing is performed with currents above 10 A, then testing capability is improved, but the test board experiences damage from the combination of mechanical force and high power electrical stress
Solution Approach 1:
The electrical testing function is segmented from the mechanical support structure. The test socket with its recessed mounting handles the electrical connections and high current paths, while the test board substrate provides mechanical support without being directly exposed to both mechanical and electrical stress simultaneously.
Solution Approach 2:
The recess structure serves as a mediator that protects the test board footprint from the combined effects of mechanical force and high power electrical stress. By isolating the test socket in the recess, the board substrate is shielded from direct exposure to these harsh conditions.
3Stability of the object's composition
If the test socket is firmly mounted on the test board using PTB concept, then mechanical stability is achieved, but the test board footprint is damaged and requires periodic replacement
Solution Approach 1:
The test socket is segmented from the test board footprint through recessed mounting. This allows the test socket to be firmly secured in its recess while the test board substrate remains protected and undamaged, maintaining overall system stability without compromising the board's longevity.
Data Source
AI summary
A test interposer includes an interposer layer configured to receive a test socket, and a stiffening layer attached to the interposer layer so that the interposer layer is kept in an unalterable shape.