Wide Bandgap Semiconductor Switching Devices in Power Conditioning Modules
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Solution Overview
Problem
Current power conditioning and uninterruptible power supply systems face inefficiencies in handling power quality events and scalability, with high semiconductor switching losses affecting overall system efficiency and noise levels.
Innovation Solution
The use of wide bandgap semiconductor switching devices in a multi-level topology within power conditioning and UPS modules reduces turn-on and turn-off losses, enabling increased system efficiency and optimization of converter frequency to minimize audible noise.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional semiconductor switching devices are used in power conditioning systems, then device complexity is reduced and ease of manufacture is improved, but system efficiency deteriorates due to high switching losses
Solution Approach 1:
The patent applies parameter changes by transitioning from conventional semiconductor materials (silicon) to wide bandgap semiconductor materials (such as silicon carbide or gallium nitride). This material parameter change enables higher switching frequencies and lower conduction losses, directly reducing semiconductor switching losses while accepting increased device complexity as a trade-off for improved system efficiency
Solution Approach 2:
The patent employs composite material structures by integrating wide bandgap semiconductor devices with multi-level converter topologies. This combination creates a hybrid system that leverages the superior electrical properties of wide bandgap materials alongside the voltage-stressing benefits of multi-level configurations, achieving reduced switching losses through the synergistic effect of material properties and circuit architecture
2Productivity
If converter frequency is increased to improve system efficiency, then power processing capability is improved, but audible noise increases
Solution Approach 1:
The patent applies periodic action principles by optimizing the converter switching frequency to operate above the human audible range (typically above 20 kHz). This allows the system to maintain high power processing capability while eliminating audible noise, as the switching occurs at frequencies imperceptible to human ears. The wide bandgap semiconductor devices enable this approach by providing sufficient switching speed capability
Solution Approach 2:
The patent employs dynamic frequency modulation techniques where the converter switching frequency can be dynamically adjusted based on operational conditions. During normal operation, the frequency is maintained above the audible range to eliminate noise, while allowing optimization of power processing efficiency based on load conditions and system requirements
3Adaptability or versatility
If power conditioning systems are made scalable with modular setup, then adaptability is improved, but system complexity increases due to multiple modules
Solution Approach 1:
The patent applies segmentation by dividing the power conditioning system into identical, independent modular units. Each module contains complete power processing functionality with wide bandgap semiconductor devices, allowing the system to be scaled by simply adding or removing modules. This segmentation enables adaptability while keeping individual module complexity manageable and identical across all units
Solution Approach 2:
The patent employs universality by designing all power conditioning modules with identical multi-functional capabilities. Each module can independently handle power conversion, conditioning, and protection functions, allowing any number of modules to be combined to serve various load requirements. This universal design simplifies the overall system architecture despite the presence of multiple modules, as all units interface in the same way
Data Source
AI summary
The present invention provides a power conditioning module (10) for connection between an AC power supply (16) and a load (24), comprising an AC power supply input (14) for connection to the AC power supply (16), whereby the AC power supply input (14) receives a first reference (42) from the AC power supply (16), a split DC link (18) with its midpoint (26) connected to a second reference (44), a power output (22) for connection to the load (24), whereby the power output (22) receives a third reference (46) from the load (24), a first converter (34) connected between the AC power supply input (14) and the split DC link (18), whereby the first converter (34) is provided to power the split DC link (18) from the AC power supply (16), a second converter (36) connected between positive and negative halves (28, 30) of the split DC link (18) and the midpoint (26), whereby the second converter (36) is provided to transfer energy between the DC link halves (28, 30), a third converter (38) connected between the split DC link (18) and the power output (22), whereby the third converter (38) is provided to power the load (24) from the split DC link (18), whereby the first, second, and third converters (34, 36, 38) enable bi-directional energy flow between at least one of the two halves (28, 30) of the split DC link (18) and the first, second or third reference (42, 44, 46), respectively, and at least one or multiple semiconductor switching devices (84, 86) of at least one of the first, second and third converter (34, 36, 38) are provided as wide band gap semiconductor switching devices (84, 86), whereby the semiconductor switching devices (84, 86) comprise controlled and/or uncontrolled semiconductor switching devices (84, 86) in an at least three-level configuration.