Wind Scooper Partitioning for Server Cooling Airflow
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
The existing heat dissipation systems in electronic devices, such as servers, suffer from poor efficiency due to airflow being redirected towards electronic parts that have already increased in temperature, reducing the cooling effectiveness for other components.
Innovation Solution
The electronic device incorporates a wind scooper with a partition board that creates separate airflow passages, guiding a first airflow through heating modules and a second airflow to secondary electronic modules without passing through the heating modules, and includes a power-supply wind scooper to prevent heated airflow from entering the power module, enhancing heat dissipation efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wind scoopers are arranged to guide airflow from fans to electronic parts, then heat dissipation efficiency is improved, but the same airflow cannot continue to cool other electronic parts after passing through heated components
Solution Approach 1:
The wind scooper is divided into multiple independent guiding structures, each responsible for directing airflow to specific electronic components. This segmentation allows different airflow paths to be created, enabling the system to cool multiple components simultaneously without the same airflow passing through heated parts repeatedly.
Solution Approach 2:
The patent introduces vertical layering with upper and lower wind scoopers positioned at different heights. The lower wind scooper guides airflow along the lower surface of the motherboard, while the upper wind scooper directs airflow over the upper surface. This dimensional separation creates independent cooling zones, allowing fresh airflow to reach multiple electronic parts without recirculation through heated components.
2Temperature
If airflow is guided through heating modules to dissipate heat, then temperature of heating modules decreases, but the airflow becomes heated and fails to cool other electronic parts
Solution Approach 1:
The airflow path is segmented into multiple independent channels using separate wind scoopers. One wind scooper directs airflow through heating modules while another independent wind scooper directs fresh airflow to other electronic parts. This segmentation ensures that heated airflow from one path does not contaminate other cooling zones, maintaining heat dissipation efficiency across all components.
Solution Approach 2:
The wind scooper acts as an intermediary structure that separates and directs different airflow streams. By positioning wind scoopers at strategic locations, the system creates distinct airflow zones where cool air is directed to different electronic components independently, preventing cross-contamination of heated and cool airflow paths.
3Reliability
If multiple wind scoopers are arranged to guide airflow to different electronic parts, then cooling coverage is improved, but device complexity increases
Solution Approach 1:
The wind scooper is designed as a multi-functional component that serves multiple purposes: it guides airflow to different electronic parts, structures airflow paths, and prevents airflow mixing. By making the wind scooper a universal element that performs multiple functions, the patent reduces the need for additional separate components, thereby managing device complexity while maintaining comprehensive cooling coverage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively decreases the operation temperatures of heating and secondary electronic modules, improving overall heat dissipation efficiency and preventing heat dissipation inefficiencies in servers.
Implementation Method 1
a fan module (150) which is located on a rear side of the motherboard along the transverse direction, and further faces the heating modules (130) and the second electronic module (180)
Implementation Method 2
The wind scooper (160) covers the heating modules (130), and has a partition board (160a) extending toward the first electronic module (120) from the fan module (150), so that a lower-layer airflow passage (C1) is formed between the partition board (160a) and the motherboard (110), and an upper-layer airflow passage (C2) is formed above the partition board (160a)
Data Source
AI summary
An electronic device includes a motherboard, a plurality of heating modules arranged on the motherboard, a first electronic module arranged on a front side of the motherboard along a longitudinal direction, a second electronic module stacked above the first electronic module, a wind scooper and a fan module being located on a rear side of the motherboard along the transverse direction and facing the heating modules and the second electronic module. The wind scooper covers the heating modules, and has a partition board to form a lower-layer airflow passage and an upper-layer airflow passage. The wind scooper guides a first airflow from the fan module to flow through the heating modules along the lower-layer airflow passage, and guides a second airflow from the fan module to flow to the second electronic module through the upper-layer airflow passage, without flowing through the heating modules.