Winding Capacitor Package with Rough Inner Casing Friction Retention
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Solution Overview
Problem
Current winding capacitor package structures lack effective methods for securely enclosing and protecting the winding assembly without relying on extra fixing structures, such as deformation parts of the casing, which can lead to instability and potential damage from external factors like moisture.
Innovation Solution
A winding capacitor package structure that includes a winding assembly, a package assembly with a casing structure and a filling body, and a conductive assembly, where the filling body is composed of layered structures connected between the winding assembly and the casing structure, and the casing structure has a rough inner surface to provide frictional retention, eliminating the need for additional fixing structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If deformation parts of the casing are used to clamp the filling body, then the filling body can be secured, but the structure becomes more complex and prone to damage from external factors
Solution Approach 1:
The patent removes the deformation parts (clamping structures) from the casing design. Instead of using complex deforming structures to clamp the filling body, the invention relies on the friction between the rough inner surface of the casing and the filling body to secure it, thereby simplifying the overall structure while maintaining retention functionality.
Solution Approach 2:
The casing's rough inner surface automatically provides frictional retention of the filling body without requiring additional active clamping mechanisms. The friction force itself serves the function of securing the filling body, eliminating the need for separate deformation parts or clamping structures.
2Reliability
If deformation parts are used for clamping, then the filling body is retained, but the capacitor becomes vulnerable to moisture ingress and external damage
Solution Approach 1:
By removing the deformation parts and clamping structures from the design, the patent eliminates the structural weaknesses and potential entry points for moisture and external factors. The simplified structure with only the rough inner surface friction mechanism reduces vulnerability to environmental damage.
Solution Approach 2:
The rough inner surface of the casing acts as a flexible retention mechanism that maintains structural integrity and seals effectiveness. This approach preserves the casing's protective function while avoiding rigid clamping structures that could compromise the seal or allow moisture ingress.
3Ease of manufacture
If a smooth inner surface is used in the casing, then manufacturing is easier, but the filling body cannot be retained without additional fixing structures
Solution Approach 1:
The patent applies a rough surface treatment only to the inner surface of the casing where friction is needed, rather than making the entire casing complex. This localized quality change provides the necessary retention function while keeping the overall manufacturing process relatively simple and cost-effective.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure securely encloses the winding assembly through frictional retention, preventing external moisture ingress and enhancing stability without requiring deformation parts for clamping, thus protecting the capacitor from environmental damage.
Implementation Method 1
The casing structure includes a rough inner surface, and the filling body is limited inside the casing structure through a friction provided by the rough inner surface of the casing structure
Data Source
AI summary
A winding-type capacitor package structure and a method of manufacturing the same are provided. The winding-type capacitor package structure includes a winding assembly, a package assembly, a conductive assembly, and a bottom carrier frame. The winding assembly includes a positive winding conductive foil and a negative winding conductive foil. The winding assembly is enclosed by the package assembly. The package assembly includes a casing structure and a filling body received inside the casing structure. The casing structure has an inner rough surface. The bottom carrier frame is disposed on a bottom portion of the casing structure. The filling body includes a plurality of layered structures, and each of the layered structure is connected between the winding assembly and the casing structure. Therefore, the filling body including the layered structures can be limited inside the casing structure through friction force provided by the inner rough surface.