Winding Core Manufacturing via Groove-Guided Substrate Separation
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Solution Overview
Problem
Existing methods for manufacturing small winding cores with dimensions less than 1 mm are prone to breaking or chipping during separation, leading to strength and reliability issues.
Innovation Solution
A method involving a mother substrate with nonconductive material, where x-direction and y-direction division grooves, and bottom surface exposure grooves are formed to create a core portion and flanges, allowing for precise separation and reduced stress on the winding cores, with terminal electrodes formed before separation to enhance handling and reduce variation in processing accuracy.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Length of moving object
If winding cores are separated from each other with a dicing machine to obtain smaller dimensions, then the size of winding electronic components is decreased, but the winding cores break or chip due to a lack of strength
Solution Approach 1:
The patent applies preliminary action by forming grooves (division grooves and bottom surface exposure grooves) into the mother substrate before separating the winding cores. These pre-formed grooves create stress concentration points that guide the breaking process, allowing the substrate to separate along predetermined paths rather than randomly fracturing during dicing. This preliminary groove formation enables controlled separation that maintains core strength even at reduced dimensions.
Solution Approach 2:
The patent segments the mother substrate into multiple winding cores through the formation of division grooves and bottom surface exposure grooves. The division grooves extend from the first main surface while bottom surface exposure grooves extend from the second main surface, creating a segmented structure that allows individual cores to be separated while maintaining their structural integrity. This segmentation approach enables production of smaller cores without compromising strength.
2Ease of manufacture
If winding cores are separated from each other with a dicing machine, then individual winding cores are obtained, but breakage and chipping occur during separation
Solution Approach 1:
The patent applies preliminary action by forming grooves (division grooves and bottom surface exposure grooves) into the mother substrate before separating the winding cores. These pre-formed grooves create stress concentration points that guide the breaking process, allowing the substrate to separate along predetermined paths rather than randomly fracturing during dicing. This preliminary groove formation enables controlled separation that maintains core strength even at reduced dimensions.
Solution Approach 2:
The grooves formed in the mother substrate act as intermediaries that facilitate the separation process. The division grooves and bottom surface exposure grooves create a structured interface between adjacent winding cores, enabling clean separation without direct mechanical contact between cores during the breaking process. This intermediary groove structure prevents chipping and breakage that would otherwise occur during dicing.
3Manufacturing precision
If terminal electrodes are disposed after separation, then individual cores can be processed, but processing accuracy varies and handling becomes difficult
Solution Approach 1:
The patent merges the terminal electrode formation process with the core separation process by forming terminal electrodes on the mother substrate before separating the winding cores. This allows terminal electrodes to be positioned with high precision relative to multiple cores simultaneously, and the electrodes remain attached to their respective cores during separation. This combined approach eliminates the need for separate handling and positioning operations, reducing both complexity and variation in processing accuracy.
Solution Approach 2:
The patent applies preliminary action by forming terminal electrodes on the mother substrate before separating the winding cores. The terminal electrodes are formed at predetermined positions on the mother substrate, and when the substrate is broken along the grooves, the electrodes remain attached to their respective cores. This preliminary electrode formation ensures consistent positioning and reduces handling complexity compared to forming electrodes after separation.
Data Source
AI summary
A mother substrate that enables winding cores to be obtained in a manner in which the mother substrate is divided along x-direction division lines and y-direction division lines is prepared. Subsequently, x-direction division grooves are formed along the x-direction division lines on a first main surface of the mother substrate, y-direction division grooves are formed along the y-direction division lines on the first main surface, and shallow bottom surface exposure grooves, for exposing surfaces that are to be core portion bottom surfaces, are formed on the first main surface. The mother substrate is divided by performing a flattening process on a second main surface of the mother substrate that is opposite the first main surface until the second main surface reaches the x-direction division grooves and the y-direction division grooves to obtain the winding cores that are separated from each other.