Winding Encapsulation With Thermally Conductive Insulating Coating
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional methods for manufacturing electronic devices with electrical windings face challenges in achieving both good thermal conductivity and electrical insulation, often requiring expensive metal cases that provide poor insulation or fragile ceramic cases that are costly and prone to damage.
Innovation Solution
A method involving pouring a heat dissipation mass into a cavity to cover an electronic component with a heat dissipation mass coating, eliminating the need for a case, and using a mold that can be reused, allowing for easy and efficient filling of voids without high pressure, thus providing both thermal conductivity and insulation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If metal cases are used to provide good thermal conductivity, then thermal conductivity is improved, but electrical insulation deteriorates
Solution Approach 1:
The patent merges the thermal management function and electrical insulation function into a single integrated heat dissipation mass component. This mass is electrically insulating but thermally conductive, eliminating the need for separate metal case and insulation layers, thus resolving the contradiction between thermal conductivity and electrical insulation.
Solution Approach 2:
The heat dissipation mass is made of composite material (e.g., resin matrix with thermal conductive fillers like aluminum oxide or nitrogen boron nitride particles) that combines electrical insulation properties of polymers with thermal conductivity of ceramic fillers, simultaneously achieving both required properties.
2Reliability
If plastic cases are used to provide good electrical insulation, then electrical insulation is improved, but thermal conductivity deteriorates
Solution Approach 1:
The patent uses composite materials consisting of resin matrix combined with thermally conductive filler particles (such as aluminum oxide, aluminum nitride, or boron nitride). This composite structure maintains the electrical insulation properties of the resin while introducing high thermal conductivity through the filler particles, resolving the contradiction between electrical insulation and thermal conductivity.
3Reliability
If ceramic cases are used to provide both thermal conductivity and electrical insulation, then both properties are improved, but manufacturing cost and fragility worsen
Solution Approach 1:
The patent replaces expensive and fragile ceramic cases with a more economical and durable alternative: a resin-based composite heat dissipation mass that can be easily molded and integrated into the electronic device housing. This composite material achieves comparable thermal and electrical properties at lower cost and with improved durability.
Solution Approach 2:
The patent employs composite materials (resin matrix with thermal conductive fillers) that replicate the dual functionality of ceramic cases (thermal conductivity and electrical insulation) while avoiding their drawbacks of high cost and fragility. The composite structure allows for easier manufacturing and integration.
4Manufacturing precision
If high pressure is used to fill voids between electronic component and case, then filling completeness is improved, but damage to electrical windings worsens
Solution Approach 1:
The patent applies preliminary action by positioning support structures (such as pillars or spacers) between the electronic component and the heat dissipation mass before the mass is fully cured or set. These support structures maintain proper spacing and prevent void formation, eliminating the need for subsequent high-pressure filling that could damage the windings.
Solution Approach 2:
The patent introduces intermediary elements (support pillars, spacers, or temporary structures) that mediate between the electronic component and the heat dissipation mass during the manufacturing process. These intermediaries ensure complete filling of voids by maintaining proper contact and spacing, while allowing the heat dissipation mass to be applied at lower pressures that do not damage the electrical windings.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method ensures homogeneous insulation, reduces material costs, prevents damage to electrical windings, and enhances thermal coupling, while allowing for adjustable mechanical tolerances and improved manufacturing efficiency.
Implementation Method 1
a heat dissipation mass is poured into the cavity so as to at least partially fill the cavity and at least partially, preferably fully, cover the electronic component with the heat dissipation mass
Data Source
AI summary
The present disclosure concerns a method of manufacturing an electronic device, where the electronic device includes at least one electronic component with at least one electrical winding, and at least one heat dissipation mass coating, and the method includes inserting the at least one electronic component into a cavity; pouring, before or after the insertion of the electronic component, a heat dissipation mass into the cavity so as to at least partially fill the cavity and at least partially cover the electronic component with the heat dissipation mass; removing the electronic device, namely, the electronic component covered by the heat dissipation mass coating, from the cavity. The present disclosure also concerns an electronic apparatus including at least one electronic device manufactured by the foregoing method.