Window BGA Package Substrate Opening for Compact Routing
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Solution Overview
Problem
Conventional window BGA semiconductor packaging techniques fail to accommodate shrinking form factors of emerging electronic devices due to insufficient miniaturization, as they lack the necessary compactness for modern devices like smartphones and computers.
Innovation Solution
The proposed solution involves a semiconductor package configuration with a substrate having an opening to facilitate electrical coupling via interconnect bumps and bonding wires, and an electrically insulative structure that encapsulates the wires and fills the opening, allowing for a more compact and robust packaging solution.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If adhesive is used to directly attach semiconductor die to substrate without interconnect bumps, then manufacturing complexity is reduced, but package size cannot be sufficiently miniaturized for emerging electronic devices
Solution Approach 1:
The patent utilizes the substrate opening as a vertical dimension to route bonding wires through the substrate thickness, allowing electrical connections without requiring lateral space for traditional bump structures. This dimensional approach enables miniaturization by exploiting the Z-axis (through-substrate routing) rather than consuming planar area.
Solution Approach 2:
The bonding wires are nested within the substrate opening, and the electrically insulative structure is nested to fill the opening while encapsulating the wires. This nesting arrangement allows multiple functional elements (wires, insulation, structural support) to occupy the same spatial envelope without increasing overall package dimensions.
2Ease of manufacture
If conventional window BGA packaging is used, then ease of manufacture is improved, but the package cannot accommodate shrinking form factors of modern electronic devices
Solution Approach 1:
The electrical connection function is segmented into two distinct pathways: interconnect bumps for power/ground connections and bonding wires through the substrate opening for signal connections. This segmentation allows optimization of each connection type independently, enabling smaller package area while maintaining manufacturing simplicity for each respective connection method.
3Ease of operation
If bonding wires are used to electrically couple semiconductor die to substrate through opening, then electrical signal routing is improved, but package robustness may be compromised without proper protection
Solution Approach 1:
The electrically insulative structure acts as an intermediary element that provides mechanical protection and structural support to the bonding wires passing through the substrate opening. This mediator structure shields the fragile wires from external stresses while maintaining their electrical function, thereby enhancing package robustness without impeding signal routing.
Solution Approach 2:
The electrically insulative structure is positioned beforehand to fill and protect the substrate opening before final package assembly. This pre-positioned protective structure cushions the bonding wires against mechanical stresses, thermal expansion differences, and handling damages that would otherwise compromise package reliability.
Data Source
AI summary
A semiconductor package includes a substrate having a first surface, a second surface that is opposite to the first surface, and an opening formed between the first surface of the substrate and the second surface of the substrate. One or more bonding wires electrically couple a first surface of a semiconductor die included in the semiconductor package to the first surface of the substrate through an opening of the substrate. A first electrically insulative structure is disposed to substantially fill an area between the first surface of the semiconductor die, the second surface of the substrate, and one or more interconnect bumps that electrically couple the semiconductor die to the substrate. The first electrically insulative structure substantially encapsulates the one or more bonding wires and substantially fills the opening of the substrate.