Window Assembly Connector for Heat-Sensitive Conductive Ink

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Solution Overview

Problem

Conductive inks used in window assemblies for vehicles are not heat resistant to conventional soldering temperatures, compromising the bonding interface with transparent substrates, and organic-based inks lack sufficient adhesion for traditional soldering applications.

Innovation Solution

A method of manufacturing a glass assembly with a solderless electrical connector involves applying a conductive ink to a curved glass substrate, followed by an adhesive, and curing the adhesive below the thermal degradation temperature of the conductive ink to form an electrical connection without soldering.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional soldering is used to connect electrical connectors to conductive ink, then electrical connection is achieved, but the conductive ink undergoes thermal degradation and loses bonding integrity

Engineering Contradiction:

Improveelectrical connection reliabilityVSAvoidsoldering temperature

Core Design Contradiction:

ReliabilityVSTemperature

Solution Approach 1:

The patent replaces the thermal soldering process with a mechanical compression process. A compression connector applies mechanical force to create electrical contact with the conductive ink trace, eliminating the need for high-temperature soldering that would degrade the organic conductive ink.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the connection parameter from thermal (soldering temperature) to mechanical (compression force). By using a compression connector that applies controlled mechanical pressure, the system achieves reliable electrical connection without subjecting the temperature-sensitive conductive ink to damaging heat.

Inventive Principle:

Principle #35Parameter changes

2Ease of manufacture

If organic-based conductive ink is used, then flexibility and ease of application are improved, but adhesion strength is insufficient for traditional soldering applications

Engineering Contradiction:

Improveconductive ink applicationVSAvoidadhesion strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The patent replaces thermal soldering with mechanical compression, which creates reliable electrical contact without requiring high adhesion strength. The compression connector maintains constant contact pressure on the conductive ink, compensating for the weaker adhesion of organic-based inks.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes from thermal bonding (soldering) to mechanical bonding (compression). This parameter change allows the use of organic-based conductive inks with lower adhesion strength, as the mechanical compression provides the necessary contact force without requiring strong thermal bonding.

Inventive Principle:

Principle #35Parameter changes

3Reliability

If solderless compression connector is used, then thermal degradation of conductive ink is prevented, but connection method complexity increases

Engineering Contradiction:

Improveconductive ink integrityVSAvoidconnector structure

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The patent introduces a compression connector as an intermediary component between the electrical connection system and the conductive ink trace. This connector mediates the connection by providing mechanical compression contact, protecting the conductive ink from thermal degradation while maintaining electrical connectivity.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The compression connector utilizes composite construction combining conductive and insulating materials. The connector body uses insulating material to prevent short circuits, while contact elements use conductive material to establish electrical connection with the conductive ink trace.

Inventive Principle:

Principle #40Composite materials

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This method enables the electrification of conductive inks through a solderless electrical connector, maintaining the integrity of the conductive ink and preventing thermal degradation.

Implementation Method 1

applying an adhesive onto the surface of the curved glass substrate adjacent to the applied conductive ink. The method also includes curing the adhesive at a temperature below the thermal degradation temperature of the applied conductive ink to form the solderless electrical connector in electrical contact with the applied conductive ink.

Methodology Applied

Scientific EffectAdhesion: Adhesive

Data Source

PatentUS12424807B2Method of manufacturing a window assembly with a solderless electrical connector

Publication Date: 2025.09.23 AGC AUTOMOTIVE AMERICAS CO

AI summary

A method of manufacturing a window assembly having a solderless electrical connector includes forming a curved transparent substrate and applying a conductive ink having a thermal degradation temperature onto a surface of the curved transparent substrate. The method further includes applying an adhesive onto the surface of the curved transparent substrate adjacent to the conductive ink and optionally onto the applied conductive ink, and curing the adhesive at a temperature below the thermal degradation temperature of the conductive ink to form the solderless electrical connector with the solderless electrical connector being in electrical contact with the applied conductive ink.