Window Frame Heat Pipe Cooling for Space Electronics
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Solution Overview
Problem
Electronic devices in space cannot be cooled by air due to the vacuum environment, and existing cooling techniques are expensive and not qualified for space applications, posing a challenge for operating ASICs at safe temperatures.
Innovation Solution
A window frame packaging system is developed that allows a heat pipe to be in direct contact with the backside of a chip, hermetically sealed to a kovar ring, enabling effective conduction cooling by creating a hermetic seal and using suitable soldering processes to maintain hermeticity and thermal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooling is used for electronic devices, then cooling effectiveness is improved, but it cannot be applied in vacuum environment of space
Solution Approach 1:
The patent replaces air cooling (convection-based mechanical system) with conduction cooling through a heat pipe and thermally conductive epoxy. The heat pipe directly contacts the chip backside, conducting heat away without requiring air medium, thus resolving the contradiction between cooling effectiveness and vacuum environment adaptability.
Solution Approach 2:
The patent introduces a heat pipe as an intermediary between the chip and the cooling system. The heat pipe serves as a thermal conduit that transfers heat from the chip backside through the window frame opening, enabling efficient heat removal in vacuum conditions where air cooling is impossible.
2Temperature
If expensive cooling techniques are used, then operating temperature control is improved, but cost and qualification for space applications worsen
Solution Approach 1:
The patent employs a cost-effective cooling solution using standard heat pipe technology and conventional packaging materials (window frame, kovar ring, solder) rather than expensive specialized space-qualified cooling systems. This approach achieves reliable temperature control while reducing cost and simplifying qualification requirements.
Solution Approach 2:
The heat pipe provides passive, self-regulating cooling without requiring external control systems or complex active cooling mechanisms. The heat pipe automatically conducts heat from the chip based on temperature gradients, providing reliable temperature control through self-service operation that is inherently suitable for space applications.
3Reliability
If hermetic seal is created between window frame and chip, then reliability in vacuum is improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines the hermetic sealing function with the existing window frame packaging structure. The window frame is soldered to both the chip and the kovar ring, integrating the seal into the packaging assembly rather than adding separate sealing components, thus improving reliability while minimizing manufacturing complexity.
Solution Approach 2:
The patent uses soldering (a thermal and metallurgical process) to create the hermetic seal between the window frame and the chip/kovar ring. By changing the physical state and properties of the solder material through controlled heating, a reliable hermetic bond is formed that ensures vacuum compatibility without requiring complex sealing mechanisms.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively cools electronic devices in space by maintaining a hermetic seal and allowing direct heat dissipation, ensuring reliable operation across temperature cycles and meeting space application standards.
Implementation Method 1
allowing for conduction cooling by creating a hermetic seal
Implementation Method 2
The window frame includes an opening to allow a heat pipe to be in direct contact with a backside of the chip
Data Source
AI summary
An apparatus for cooling electronic devices to be used in the vacuum of space is described. a window frame is provided as packaging for an electronic device having a substrate and a chip. The window frame includes an opening to allow a heat pipe to be in direct contact with a backside of the chip. The window frame is hermetically sealed to the backside of the chip. The window frame is also welded to a kovar ring located on the backside of the chip to provide a hermetic seal between the window frame and the substrate.