Window-Mounted Polishing Pad Prevents Deformation
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Solution Overview
Problem
Existing window-mounted polishing pads deform due to thermal or vibration fusion methods used for attaching the window, leading to slurry leakage through gaps between the window and the polishing pad.
Innovation Solution
A window-mounted polishing pad design that omits thermal and vibration fusion methods, featuring a polishing layer with a first punched hole, a window inserted into this hole, a lower support layer with a second punched hole for optical beam transmission, an adhesive layer that does not contact the window's edge, and a sealing adhesive member between the window and the adhesive layer to prevent slurry leakage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If thermal fusion method is used to attach the window to the polishing pad, then the window can be securely fixed, but the polishing pad deforms due to high-temperature heat energy
Solution Approach 1:
The patent replaces the thermal fusion method with a mechanical pressing method. The window is attached to the polishing pad by applying pressure through a press, without using heat. This substitution eliminates the thermal energy that causes deformation while maintaining the bonding function through mechanical compression and adhesion.
Solution Approach 2:
The patent changes the attachment parameters from high-temperature thermal conditions to room-temperature mechanical conditions. By modifying the attachment method from thermal fusion to mechanical pressing, the patent avoids the harmful thermal effects while achieving secure fixation of the window.
2Strength
If thermal fusion method is used to attach the window, then bonding is achieved, but polishing slurry leaks through gaps between the window and polishing pad
Solution Approach 1:
The patent replaces thermal fusion with mechanical pressing to attach the window. This mechanical attachment method creates a more reliable seal that prevents polishing slurry from penetrating into gaps, thereby improving sealing performance while maintaining bonding strength.
Solution Approach 2:
The patent applies preliminary anti-action by using a mechanical pressing method that pre-compresses the window and polishing pad together, creating a tight seal before the polishing process begins. This preliminary compression prevents slurry from penetrating into gaps during the polishing operation.
3Strength
If vibration fusion method is used to attach the window, then the window can be fixed, but the polishing pad deforms
Solution Approach 1:
The patent replaces the vibration fusion method with a simple mechanical pressing method. Instead of using vibrational energy to achieve bonding, the patent uses direct mechanical compression to attach the window, thereby avoiding the deformation caused by vibrational forces while maintaining secure fixation.
Data Source
Figure 1~2
Figure 3(a)~3(d)
AI summary
Disclosed are a window-mounted polishing pad in which since a thermal fusion method and a vibration fusion method are not applied while the window is inserted into and attached to the polishing pad, the polishing pad is not deformed and polishing slurry does not leak through a gap between the window and the polishing pad, and a method of manufacturing the same. The window-mounted polishing pad includes: a polishing layer in which a first punched hole is formed in a thickness direction; a window that is inserted into and fixed to the first punched hole of the polishing layer; a lower support layer that is positioned below the polishing layer and the window and has a second punched hole for irradiating an optical beam formed at a lower end side of the window and having a narrower width than the first punched hole or the window; an adhesive layer that mediates bonding of the polishing layer and the lower support layer, has the same area as the lower support layer, and partially overlaps but does not contact an edge portion of the window; and a sealing adhesive member positioned between the window and the adhesive layer.