Display Window Substrate Cutting and Chamfering With Dual Laser Beams
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Solution Overview
Problem
The challenge lies in precisely cutting and chamfering thin substrates for windows in display devices, as the thickness decreases and size increases, making it difficult to achieve accurate manufacturing with existing methods.
Innovation Solution
A window manufacturing method and apparatus that uses a combination of laser beams with different pulse energies, where a first beam cuts the substrate and a second beam forms a target substrate with a chamfer, utilizing a Bessel beam for precise cutting and an etchant for chamfering, allowing for accurate shaping and increased reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Weight of moving object
If the thickness of the substrate is decreased to reduce weight and improve user convenience, then the weight and user convenience are improved, but the precision of cutting and chamfering deteriorates
Solution Approach 1:
The cutting process is segmented into two distinct stages: first, a laser beam cuts through the entire thickness of the thin substrate to separate the target substrate from the mother substrate; second, a different laser beam with lower pulse energy performs chamfering on the cut surface. This segmentation allows each process to be optimized independently, enabling precise cutting and chamfering of thin substrates that would be difficult to achieve with a single process.
Solution Approach 2:
Different regions of the substrate receive different laser beam parameters: the cutting line receives high pulse energy to penetrate through the thin substrate, while the chamfering region receives lower pulse energy to create a beveled edge without excessive material removal or damage. This local differentiation of beam parameters enables precise control over the quality of different features on the thin substrate.
2Area of stationary object
If the size of the substrate is increased, then the display area is improved, but the precision of cutting and chamfering deteriorates
Solution Approach 1:
The processing is divided into two sequential laser beam operations: first cutting the large substrate into smaller target substrates, then performing chamfering on each target substrate. This segmentation makes it feasible to process large-area substrates by breaking them down into manageable pieces that can be precisely finished.
Solution Approach 2:
The solution introduces a temporal dimension to the processing by using substantially simultaneous irradiation of two laser beams with different parameters. This allows the system to handle large substrates by processing different regions with different beam energies at the same time, effectively managing the complexity of large-area processing.
3Device complexity
If a single laser beam is used for cutting, then the device complexity is reduced, but the manufacturing precision of thin substrates deteriorates
Solution Approach 1:
The laser processing system is segmented into two beam generation paths with different pulse energy parameters. One beam is optimized for cutting through the thin substrate, while the other is optimized for chamfering. This segmentation of the laser system enables precise control over both cutting and chamfering processes while maintaining relative device simplicity by using the same laser source type.
Solution Approach 2:
The system changes the pulse energy parameter of the laser beam to perform different functions: high pulse energy for cutting and lower pulse energy for chamfering. This parameter variation allows a single laser source to perform multiple functions with different precision requirements, balancing device complexity with manufacturing precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the accurate cutting and chamfering of thin substrates, improving the reliability and precision of window manufacturing, particularly for thin and large-sized substrates, ensuring the production of high-quality windows for display devices.
Implementation Method 1
A pulse energy of the first beam may be different from a pulse energy of the second beam and the first beam may be irradiated to the cutting line of the mother substrate
Implementation Method 2
the second beam may be irradiated to a point spaced apart from the cutting line of the mother substrate by a distance
Implementation Method 3
providing an etchant to the target substrate to chamfer the target substrate
Data Source
AI summary
A window manufacturing method includes providing a mother substrate on a moving stage, the mother substrate including a cutting line; irradiating substantially simultaneously a first beam and a second beam to the mother substrate to cut the mother substrate and to form a target substrate; separating the target substrate from the mother substrate; and providing an etchant to the target substrate to chamfer the target substrate. The first beam is irradiated to the cutting line of the mother substrate, the second beam is irradiated to a point spaced apart from the cutting line of the mother substrate by a distance, and a pulse energy of the first beam is different from a pulse energy of the second beam.