Window Substrate Cutting With Dual-Beam Laser Chamfering
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Solution Overview
Problem
Existing window manufacturing methods face challenges in precisely cutting and chamfering thin, large substrates due to difficulties in maintaining accuracy and reliability, especially as substrate thickness decreases and size increases.
Innovation Solution
A window manufacturing method and apparatus that uses simultaneous irradiation of laser beams with different pulse energies to cut and chamfer substrates, employing Bessel beams and an etchant to achieve precise cutting and chamfering, with the etchant viscosity enhanced by organic materials to improve surface angles and reduce thickness.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional cutting methods are used on thin substrates, then manufacturing process is simple, but cutting precision and reliability deteriorate
Solution Approach 1:
The cutting process is segmented into two distinct stages: first, a laser beam creates a cutting line through the substrate, and second, a chisel edge tool follows the cutting line to separate the substrate. This segmentation allows each tool to perform its specialized function optimally, achieving high precision on thin substrates without requiring a single complex cutting mechanism.
Solution Approach 2:
The cutting line created by the laser beam serves as an intermediary guide for the chisel edge tool. The laser-prepared cutting line acts as a precise pathway that enables the mechanical tool to achieve accurate separation, combining the advantages of both laser precision and mechanical cutting effectiveness.
2Weight of moving object
If substrate thickness is reduced to minimize display device weight, then weight decreases, but cutting and chamfering accuracy deteriorates
Solution Approach 1:
The laser beam performs preliminary action by creating a precise cutting line and preparing the substrate surface before the chisel edge tool completes the separation. This preliminary laser treatment enables accurate cutting and chamfering of thin substrates by pre-defining the exact path and preparing the material structure for clean separation.
Solution Approach 2:
The invention replaces conventional direct mechanical cutting with a hybrid approach where laser energy substitutes for mechanical force in the initial cutting phase. The laser beam melts or vaporizes material along the cutting path, eliminating the need for high mechanical forces that would be required to cut thin substrates mechanically, thereby maintaining precision while reducing substrate thickness.
3Manufacturing precision
If single beam cutting is used, then process is simple, but chamfering quality and surface angle precision deteriorate
Solution Approach 1:
The cutting system is segmented into two functional beams: a primary laser beam that creates the cutting line and a secondary beam (or beam configuration) that provides chisel edge action for separation and chamfering. This segmentation allows each beam to be optimized for its specific function, achieving high chamfering quality and surface angle precision.
Solution Approach 2:
The invention merges laser cutting and mechanical chisel edge cutting into a single integrated process. The laser beam and chisel edge tool work simultaneously in coordination, with the laser creating the cutting line and the chisel edge completing the separation and forming the chamfer, achieving both cutting and chamfering in one operation with high precision.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The method and apparatus enable the accurate cutting and chamfering of thin substrates with improved reliability, ensuring precise control over the cutting process and achieving desired shapes with minimal thickness reduction.
Implementation Method 1
irradiating substantially simultaneously a first beam and a second beam to the mother substrate to cut the mother substrate
Implementation Method 2
providing an etchant to the target substrate to chamfer the target substrate
Data Source
AI summary
A window manufacturing method includes providing a mother substrate on a moving stage, the mother substrate including a cutting line; irradiating substantially simultaneously a first beam and a second beam to the mother substrate to cut the mother substrate and to form a target substrate; separating the target substrate from the mother substrate; and providing an etchant to the target substrate to chamfer the target substrate. The first beam is irradiated to the cutting line of the mother substrate, the second beam is irradiated to a point spaced apart from the cutting line of the mother substrate by a distance, and a pulse energy of the first beam is different from a pulse energy of the second beam.