Windowed Heat Pipe Cold Plate Interface With Lower Thermal Resistance
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Solution Overview
Problem
Conventional heat pipe designs for computing systems have limited surface area for heat transfer and thermal resistance, leading to reduced thermal performance and increased risks of dryout, which can negatively impact semiconductor devices.
Innovation Solution
The introduction of a cavity or window on the inner surface of the heat pipe and/or cold plate increases the thermal transfer area, reduces thermal resistance, and enhances the capillary limit by allowing more working fluid storage without increasing the surface area, using materials like pure copper and eliminating the solder layer to improve conductivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional soldered heat pipe design is used, then manufacturing simplicity is maintained, but thermal performance is limited due to solder layer resistance and limited heat transfer surface area
Solution Approach 1:
The invention removes the solder layer from the heat pipe-cold plate interface, extracting the thermal resistance element from the system. This is achieved through direct mechanical coupling of the heat pipe to the cold plate, eliminating the intermediate solder joint and its associated thermal resistance.
Solution Approach 2:
The invention transitions from a point-contact or line-contact soldered joint to a large-area surface contact between the heat pipe and cold plate. This dimensional change from 0D/1D contact to 2D contact dramatically increases the heat transfer surface area and reduces contact thermal resistance.
2Reliability
If heat transfer capability is increased by adding more heat pipes or using multi-directional heat pipes, then thermal performance improves, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat pipe is segmented into multiple independent heating zones along its length, with each zone capable of transferring heat to the cold plate. This segmentation allows a single heat pipe to perform the function of multiple traditional heat pipes, reducing the total number of components needed.
Solution Approach 2:
The heat pipe is designed to serve multiple functions simultaneously: it provides structural support, acts as a thermal conductor, and creates large-area thermal contact with the cold plate. This multi-functionality eliminates the need for additional components that would otherwise be required to achieve the same thermal performance.
3Reliability
If heat pipe surface area for heat transfer is increased, then thermal performance improves, but the heat pipe volume and manufacturing complexity increase
Solution Approach 1:
The heat pipe features localized surface modifications (such as extended surfaces or fins) at specific contact regions with the cold plate, rather than uniformly increasing the entire heat pipe surface area. This allows concentrated heat transfer enhancement at critical interfaces without proportionally increasing overall volume.
Solution Approach 2:
The heat pipe design incorporates nested or layered structures where additional heat transfer surfaces are integrated within or alongside the main heat pipe body, maximizing surface area utilization within constrained volume.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances thermal performance, reduces the risk of dryout, and increases the lifespan of heat pipes, enabling improved cooling and increased power capabilities for semiconductor devices.
Implementation Method 1
Heat pipes are a heat-transfer device that combines the principles of both thermal conductivity and phase transition to effectively transfer heat between two solid interfaces
Implementation Method 2
Heat pipes are a heat-transfer device that combines the principles of both thermal conductivity and phase transition to effectively transfer heat between two solid interfaces
Implementation Method 3
The wick structure is saturated with a working fluid that is transported from a condenser back to an evaporator through capillary action
Data Source
AI summary
Disclosed embodiments are relate to heat transfer devices or heat exchangers for computing systems, and in particular, to heat pipes for improved thermal performance at a cold plate interface. A thermal exchange assembly includes a heat pipe (HP) directly coupled to a cold plate. The HP includes a window, which is a recessed or depressed portion of the HP. The window is attached to the cold plate at a window section of the cold plate. The cold plate is configured to be placed on a semiconductor device that generates heat during operation. The cold plate transfers the heat to the HP with less thermal resistance than existing HP solutions. Other embodiments may be described and/or claimed.