Windowed Heat Spreader for Semiconductor Package Thermal Release
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Prior art heat spreaders in semiconductor devices can trap thermal energy, leading to inadequate thermal management of enclosed components, which is a challenge as devices shrink in size and operate at higher frequencies.
Innovation Solution
A windowed heat spreader design is implemented, where a heat spreader with openings allows thermal energy to escape, facilitating better thermal management by enabling the attachment of a heat sink and accommodating components of varying heights and configurations, including mesh openings for enhanced convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader forms an enclosure over semiconductor components, then thermal energy is contained and directed to heat sinks, but thermal energy becomes trapped within the package causing inadequate thermal management
Solution Approach 1:
The heat spreader is segmented by forming openings (windows) through its structure, dividing it into regions that can simultaneously perform thermal containment and thermal release functions. This segmentation allows different portions of the heat spreader to serve different thermal management purposes for different components.
Solution Approach 2:
Different regions of the heat spreader are given different properties: solid regions provide thermal containment and conduction to heat sinks, while opened regions allow thermal energy escape and convection. This local differentiation of properties enables simultaneous optimization of thermal management for different components.
2Ease of manufacture
If a uniform heat spreader structure is used, then manufacturing is simplified, but components of varying heights and configurations cannot be accommodated
Solution Approach 1:
The heat spreader structure is segmented with openings positioned to accommodate different component heights and configurations. This segmentation allows the heat spreader to adapt to varied component layouts while maintaining a relatively simple overall structure that can be manufactured using standard processes.
Solution Approach 2:
The heat spreader with openings serves multiple functions simultaneously: it provides thermal conduction paths, creates convection channels, accommodates different component heights, and maintains structural integrity. This multi-functionality allows a single structure to handle various component configurations.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The windowed heat spreader effectively dissipates thermal energy, preventing overheating and ensuring reliable operation of semiconductor devices by allowing thermal energy to escape and improving thermal handling capacity.
Implementation Method 1
The heat spreaders help dissipate heat from the semiconductor die by spreading out the thermal energy over a larger surface area
Implementation Method 2
a heat spreader with openings allows thermal energy to escape, facilitating better thermal management
Data Source
AI summary
A semiconductor device has a substrate and a first semiconductor die disposed over the substrate. A subpackage is also disposed over the substrate. A stiffener is disposed over the substrate around the first semiconductor die and subpackage. A heat spreader is disposed over the stiffener. The heat spreader is thermally coupled to the first semiconductor die. The heat spreader has an opening over the subpackage.