Windowed Package-on-Package Substrate for Reduced Assembly Height
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Solution Overview
Problem
Existing package-on-package (POP) configurations in semiconductor devices face challenges in reducing assembly height, optimizing surface area utilization, and facilitating easier routing among components, particularly when employing windowed substrates.
Innovation Solution
The use of windowed POP configurations where a first semiconductor device is positioned proximate to a window in an overlying substrate, with other devices distributed around the window's periphery, allowing for reduced assembly height and enhanced surface area utilization through strategic placement and connection of electrically conductive elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a windowed substrate configuration is employed in POP assemblies, then surface area utilization and routing ease are improved, but assembly height reduction is limited
Solution Approach 1:
The patent implements a nested configuration where a first substrate is positioned within a window formed in a second substrate, creating a nested doll-like structure. The first substrate with its semiconductor device is inserted through the window and held in place by the recess, allowing compact stacking while maintaining optimal surface area utilization for routing and component placement.
Solution Approach 2:
The patent transitions from a planar two-dimensional layout to a three-dimensional stacked configuration by utilizing vertical space through the window recess. This dimensional change allows components to be arranged in multiple layers, improving surface area utilization and routing efficiency while controlling overall assembly height through precise recess depth management.
2Ease of operation
If devices are distributed around the window periphery, then routing ease and surface area utilization are improved, but manufacturing complexity increases
Solution Approach 1:
The patent segments the substrate assembly into distinct functional zones: the window region for inserting the first substrate, the recess area for mechanical support and electrical connection, and the periphery region for distributing additional semiconductor devices. This segmentation facilitates easier routing by providing dedicated pathways and connection points while organizing manufacturing steps into manageable segments.
Solution Approach 2:
The patent incorporates preliminary actions in the manufacturing process by pre-forming the window and recess structures in the second substrate before final assembly. Electrical connection elements are pre-positioned in the recess, and the first substrate is pre-aligned, which simplifies the final assembly step and reduces overall manufacturing complexity despite the distributed periphery configuration.
3Length of stationary object
If the first substrate is positioned within the window, then assembly height is reduced, but electrical connection complexity increases
Solution Approach 1:
The patent introduces an intermediary recess structure that mediates the electrical connection between the first substrate positioned in the window and the second substrate. The recess contains electrical connection elements that bridge the gap between substrates, simplifying the connection process while maintaining reduced assembly height. This intermediary structure provides a controlled interface for electrical connections without requiring complex external wiring.
Data Source
AI summary
Semiconductor device packages for incorporation into semiconductor device assemblies may include a substrate including an array of electrically conductive elements located on a lower surface of the substrate. A window may extend through the substrate from the lower surface to an upper surface of the substrate. The array of electrically conductive elements may at least partially laterally surround a periphery of the window, and the substrate may extend laterally beyond the array of electrically conductive elements. At least a portion of a heat-management structure may be located within the window. At least a portion of an outer periphery of an underlying substrate may laterally overlap with an inner portion of the substrate defining the periphery of the window.