Electronic Component Wing Portion for Compact Power Conversion Cooling
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Solution Overview
Problem
Existing power conversion apparatuses face challenges in enhancing cooling efficiency for semiconductor modules while maintaining a compact size, as increasing contact pressure between modules and cooling pipes leads to reactor displacement and increased apparatus size.
Innovation Solution
The power conversion apparatus incorporates a semiconductor module, electronic components, and cooling pipes, with a casing design featuring wing portions on the electronic components that protrude to contact an abutting surface, allowing increased pressurizing force without shifting the reactor, thus securing contact pressure and reducing the apparatus's size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the pressurizing force of the compression spring is increased to improve cooling efficiency, then the contact pressure between semiconductor modules and cooling pipes is improved, but the reactor is shifted in the laminate direction and the apparatus size increases
Solution Approach 1:
The invention introduces a protrusion that extends in the width direction (perpendicular to the laminate direction) to provide a new dimension for load bearing. This protrusion contacts the abutting surface to counteract the pressing force, allowing the system to resolve the force balance without increasing apparatus size in the laminate direction.
Solution Approach 2:
The reactor is segmented into distinct functional parts: a body portion for containing the coil and a protrusion portion for mechanical support. This segmentation allows the protrusion to specifically handle the pressing force from the compression spring while the body portion maintains its cooling function, resolving the contradiction between cooling efficiency and apparatus size.
2Stability of the object's composition
If the number of bolts is increased to prevent reactor displacement, then the fixing force is improved, but the number of components increases and the apparatus size increases
Solution Approach 1:
The protrusion serves multiple functions: it provides a bearing surface for the compression spring, prevents reactor displacement in the width direction, and maintains structural integrity. This multi-functional design replaces the need for additional bolts, reducing component count while maintaining stability.
Solution Approach 2:
The invention extracts the displacement prevention function from the bolt system and assigns it to the protrusion- abutting surface interface. This separation allows the bolts to focus solely on securing the reactor to the housing case while the protrusion handles the compression spring loading, simplifying the overall structure.
3Force
If the size of the reactor is increased to overcome large load, then the load bearing capacity is improved, but the apparatus size increases
Solution Approach 1:
The protrusion is strategically positioned to contact the abutting surface at a specific location that provides optimal leverage for counteracting the compression spring force. This localized structural feature concentrates the load-bearing capability where needed without increasing the overall reactor volume.
Solution Approach 2:
Instead of increasing reactor size in the laminate direction to handle the load, the invention utilizes the width direction by extending the protrusion. This dimensional shift allows the reactor to bear the compression load without increasing its footprint or overall apparatus size.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves cooling efficiency for semiconductor modules by maintaining contact pressure without increasing the reactor's load or size, allowing for a more compact power conversion apparatus.
Implementation Method 1
a compression spring is used to pressure the laminate of the semiconductor modules and the reactor in the laminate direction
Implementation Method 2
a plurality of cooling pipes that cool the semiconductor module and the electronic component
Data Source
AI summary
A power conversion apparatus includes: a semiconductor module, an electronic component, a plurality of cooling pipes and a casing that accommodates the semiconductor module, the electronic component and the cooling pipes. An abutting surface is provided at a part of the casing, in which the electronic component comes into contact with the abutting surface. A pressurizing member pressurizes the semiconductor module in a first direction extending from the semiconductor module to the electronic component. The electronic component includes a part body and a wing portion and the wing portion protrudes from the part body at least either one side of both sides thereof with respect to a second direction perpendicular to the first direction, and comes into contact with the abutting surface from a semiconductor module side with respect to the first direction.