Wing-Shaped Support Members for Semiconductor Probe Tips

Resolve Bottlenecks,
Find Innovative Solutions
Generate Solutions

Solution Overview

Problem

Semiconductor device probes face challenges in maintaining rigidity and durability, especially when testing smaller transistor geometries, leading to reduced lifespan and slower testing speeds due to deformity under applied forces.

Innovation Solution

The implementation of wing-shaped support members on semiconductor device probes, specifically formed on the tip between the base and the pointed end, increases the rigidity of the probe tip, allowing it to resist deformity and maintain precision contact with semiconductor devices without interfering with automated vision control systems.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the probe tip is made smaller to test smaller transistor geometries, then the measurement precision is improved, but the rigidity of the tip deteriorates, causing deformity under applied forces

Engineering Contradiction:
Improvetip size for smaller transistor geometriesVSAvoidrigidity of probe tip
Core Design Contradiction:
Measurement precisionVSStrength

Solution Approach 1:

The support member extends radially outward from the probe tip in a direction perpendicular to the longitudinal axis, adding structural support in a different dimensional orientation. This radial extension provides stiffness to resist bending forces while maintaining a small tip diameter for precision testing of smaller transistor geometries.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The support member is formed from a material that is mechanically coupled to the probe tip, creating a composite structure where the support member reinforces the tip. This composite construction allows the tip to maintain both small dimensions for precision and enhanced rigidity for resisting applied forces during testing.

Inventive Principle:
Principle #40Composite materials

2Adaptability or versatility

If the probe tip is made smaller to increase integration capability, then the adaptability is improved, but the duration of action deteriorates due to reduced lifespan from deformity

Engineering Contradiction:
Improvecapability to test smaller transistor geometriesVSAvoiduseful lifespan of probe
Core Design Contradiction:
Adaptability or versatilityVSDuration of action of stationary object

Solution Approach 1:

By adding support structure in the radial dimension rather than increasing the longitudinal length of the tip, the probe maintains its ability to test smaller transistor geometries while gaining the structural strength needed for prolonged use without deformity-induced failure.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The reinforced composite structure extends the probe's operational life by preventing deformity that would lead to failure, while preserving the small tip size required for testing highly integrated semiconductor devices with smaller transistor geometries.

Inventive Principle:
Principle #40Composite materials

3Strength

If support members are added to increase rigidity, then the strength is improved, but the device complexity increases

Engineering Contradiction:
Improverigidity of probe tipVSAvoidstructure of probe
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The support member is configured as a simple radial extension from the tip, adding strength through a straightforward geometric addition rather than a complex multi-component structure. This minimalistic approach increases rigidity while keeping the overall device complexity low.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Solution Approach 2:

The support member is formed as an integral part of the probe tip structure, creating a composite that strengthens the tip without requiring separate assembly steps or multiple discrete components, thus minimizing the increase in device complexity.

Inventive Principle:
Principle #40Composite materials

4Measurement precision

If the pointed end is made smaller for better access, then the measurement precision is improved, but the resistance to deformity deteriorates

Engineering Contradiction:
Improvepointed end size for feature accessVSAvoidresistance to deformity
Core Design Contradiction:
Measurement precisionVSReliability

Solution Approach 1:

The support member provides structural reinforcement in the radial dimension, creating a stiffening effect that protects the small pointed end from deformity while preserving its small size for accessing and contacting small semiconductor features with precision.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Data Source

PatentUS7872486B2Wing-shaped support members for enhancing semiconductor probes and methods to form the same
Publication Date: 2011.01.18 TEXAS INSTRUMENTS INC
  • US7872486B2 patent drawing
  • US7872486B2 patent drawing
  • US7872486B2 patent drawing

AI summary

Example wing-shaped support members for enhancing semiconductor device probes and methods to form the same are disclosed. A disclosed example semiconductor device probe includes a finger having a first end and a second end. The example probe further includes a tip having a base and a pointed end. The base is joined to the first end of the finger and the tip tapers from the base to the pointed end. The probe also includes a support member on the tip to increase a rigidity of the tip.